Complementary touch panel electrodes

ABSTRACT

A multi-layer touch panel having an upper and a lower electrode that cross over one another. The electrode pattern for either electrode at the cross over area is complementary to the other electrode at the cross over area.

BACKGROUND

Touch screen sensors detect the location of an object (e.g. a finger ora stylus) applied to the surface of a touch screen display or thelocation of an object positioned near the surface of a touch screendisplay. These sensors detect the location of the object along thesurface of the display, e.g. in the plane of a flat rectangular display.Examples of touch screen sensors include capacitive sensors, resistivesensors, and projected capacitive sensors. Such sensors includetransparent conductive elements that overlay the display. The elementsare combined with electronic components that use electrical signals toprobe the elements in order to determine the location of an object nearor in contact with the display.

In the field of touch screen sensors, there is a need to have improvedcontrol over the electrical properties of the transparent touch screensensors, without compromising optical quality or properties of thedisplay. A transparent conductive region of a typical touch screensensor includes a continuous coating of a transparent conducting oxide(TCO) such as indium tin oxide (ITO), the coating exhibiting electricalpotential gradients based on the location or locations of contact to avoltage source and the overall shape of the region. This fact leads to aconstraint on possible touch sensor designs and sensor performance, andnecessitates such measures as expensive signal processing electronics orplacement of additional electrodes to modify the electrical potentialgradients. Thus, there is a need for transparent conductive elementsthat offer control over electrical potential gradients that isindependent of the aforementioned factors.

There is an additional need in the field of touch screen sensors thatrelates to flexibility in the design of electrically conductiveelements. The fabrication of touch screen sensors using patternedtransparent conducting oxides (TCO) such as indium tin oxide (ITO) oftenplaces limitations on conductor design. The limitations relate to aconstraint caused by patterning all of the conductive elements from atransparent sheet conductor that has a single value of isotropic sheetresistance.

SUMMARY

Electrode designs for use in a matrix-type mutual capacitive touchpanel. Where an upper an lower electrode in such a touch panel crossover one another, to form a node, the patterns of the upper and lowerelectrode vary, across the cross-over area, such that the patterns arecomplementary. In some embodiments this may allow for improvedcapacitive coupling with pointing objects, such as fingers, and improvedsignal to noise performance characteristics.

In one embodiments, a multi-layer touch panel is described, the panelcomprising an upper electrode comprised of an interconnected upper meshof micro-wire conductors; a lower electrode comprised of aninterconnected lower mesh of micro-wire conductors; a dielectricdisposed between the upper electrode and lower electrode; wherein theupper electrode crosses-over the lower electrode at a cross-over area,thus defining an upper electrode cross-over area having a firstconductor pattern, and a lower electrode cross-over area having a secondconductor pattern; wherein the first conductor pattern has a firstvariable active areal conductor density and the second conductor patternhas a second variable active areal conductor density; and, wherein thefirst and second variable active areal conductor densities arecomplementary to one another.

In a further embodiment, a multi-layer touch panel is described, thetouch panel comprising an upper electrode comprised of an interconnectedupper mesh of micro-wire conductors; a lower electrode comprised of aninterconnected lower mesh of micro-wire conductors; a dielectricdisposed between the upper electrode and lower electrode; wherein theupper electrode crosses-over the lower electrode at a cross-over area,thus defining an upper electrode cross-over area having a firstconductor pattern, and a lower electrode cross-over area having a secondconductor pattern; wherein the first conductor pattern has a uniformactive areal conductor density and the second conductor pattern has avariable active areal conductor density; and, wherein at least a portionof the second conductor pattern has a higher active areal conductordensity than the active areal conductor density of the first conductorpattern.

In a further embodiment, a multi-layer touch panel described, the touchpanel comprising an upper electrode comprised of an interconnected uppermesh of micro-wire conductors; a lower electrode comprised of aninterconnected lower mesh of micro-wire conductors; a dielectricdisposed between the upper electrode and lower electrode; wherein theupper electrode crosses-over the lower electrode at a cross-over area,thus defining an upper electrode cross-over area having a firstconductor pattern, and a lower electrode cross-over area having a secondconductor pattern; wherein the first conductor pattern has a variableactive areal conductor density and the second conductor pattern has auniform active areal conductor density; and, wherein at least a portionof the first conductor pattern has a lower active areal conductordensity than the active areal conductor density of the second conductorpattern.

These and other embodiments are described below.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention may be more completely understood in consideration of thefollowing detailed description of various embodiments of the inventionin connection with the accompanying drawings, in which:

FIG. 1 illustrates a schematic diagram of a touch screen sensor 100;

FIG. 2 illustrates a perspective view of a conductive visible lighttransparent region lying within a touch screen sensing area;

FIGS. 3 a and 3 b illustrates a process for creating microconductorsusing UV laser curing of a conductive ink;

FIG. 4 illustrates a gravure printing process for creatingmicroconductors;

FIG. 5 illustrates a cross section view of microreplicated channelsfilled with conductive material;

FIG. 6 illustrates a finger capacitively coupling with microreplicatedchannels filled with conductive material;

FIGS. 7 a and 7 b illustrates patterns of microconductors produced on aflexible substrate, useful for producing touch sensors;

FIG. 8 illustrates parallel microconductors printed on a flexible webmaterial in the downweb direction;

FIG. 9 illustrates a section of the flexible material from FIG. 8 havingadditional interconnecting conductors added;

FIG. 10 illustrates a cross section of an example of a matrix touchsensor constructed from two layers of the materials from FIG. 9;

FIG. 11 illustrates the conductor micropattern for one embodiment of thetouch screen sensor;

FIG. 12 illustrates a portion of the conductor micropattern illustratedin FIG. 3, the portion including a conductive mesh with selective breaksfor modulating the local sheet resistance as well as a larger feature inthe form of a contact pad;

FIG. 13 illustrates a modulation in resistance along the horizontal meshbars given in FIG. 3, created by selective breaks in the contiguousmesh;

FIG. 14 is a circuit diagram that approximates the properties of theconductor micropattern illustrated in FIG. 3, where capacitive platesare separated by resistive elements;

FIG. 15 illustrates the conductor micropattern for one embodiment of thetouch screen sensor, the micropattern including regions labeled 15 a-15e with different sheet resistance created in part by selective breaks inthe electrically conductive micropattern mesh;

FIGS. 15 a-15 e each illustrate a portion of the varying conductormicropattern illustrated in FIG. 15;

FIG. 16 illustrates the distribution of resistance per unit length alongthe long axis of the wedge-shaped transparent conductive region havingregions 15 a and 15 b therein, as compared with the resistance per unitlength for a similarly shaped region comprising only a uniformtransparent conducting oxide, ITO;

FIG. 17 illustrates the arrangement of layers that are laminatedtogether to form one embodiment of the touch screen sensor, an X-Y gridtype projected capacitive touch screen sensor;

FIG. 18 illustrates the conductor micropattern for the X-layer or theY-layer of an embodiment of the touch screen sensor according to FIG.17;

FIG. 19 illustrates a portion of the conductor micropattern illustratedin FIG. 10, the portion including a visible light transparent conductivemesh contacting a larger feature in the form of a contact pad, as wellas electrically isolated conductor deposits in the space between themesh regions;

FIG. 20 illustrates the conductor micropattern for the X-layer or theY-layer of another embodiment of the touch screen sensor according toFIG. 9;

FIG. 21 illustrates a portion of the conductor micropattern given inFIG. 12, the portion including a visible light transparent conductivemesh contacting a larger feature in the form of a contact pad, as wellas electrically isolated conductor deposits in the space between themesh regions;

FIG. 22 illustrates the conductor micropattern for the X-layer or theY-layer of another embodiment of the touch screen sensor according toFIG. 17; and

FIG. 23 illustrates a portion of the conductor micropattern given inFIG. 22, the portion including a visible light transparent conductivemesh contacting a larger feature in the form of a contact pad, as wellas electrically isolated conductor deposits in the space between themesh regions.

FIG. 24 illustrates a graph to reflect optical quality of the touchscreen sensor, the graph being a plot of Percent of Open Area vs.conductor trace width (in micrometers), with Region 3 being good opticalquality that can be used for a touch screen sensor, Region 2 beingbetter in optical quality as compared to Region 2, and Region 1 havingthe best optical quality of the three regions. Percent of Open Area isused interchangeably with open area fraction herein.

FIG. 25 and FIG. 26 illustrate scanning electron photomicrographs of thegeometry for the hexagonal mesh (sometimes referred to as “hex” mesh)and square mesh that are characteristic of Examples 6 through 40. Thelight shade lines in each image represent the pattern of the metalconductor and the dark area represents the substrate used in theExamples.

FIGS. 27, 27 a, and 27 b illustrate various portions of a firstpatterned substrate;

FIGS. 28, 28 a, and 28 b illustrate various portions of a secondpatterned substrate;

FIGS. 29, 30 a, 30 b, 31 a, 31 b, 31 c, 32, 33, 34, 35, and 36illustrate various electrode configurations including an open area;

FIGS. 37 and 38 show complementary electrode designs;

FIG. 39 shows a plan view of an upper and lower electrode crossing overone another;

FIG. 40 shows column and row electrodes that complement each other;

FIG. 41 shows a matrix-type touch sensor panel with four rows and fourcolumns, and thus 16 nodes;

FIGS. 42, 43, 44, 45, 46, and 47 show further complementary electrodedesign embodiments;

FIG. 48 illustrates a projected capacitive touch screen transparentsensor element constructed from the first and second patternedsubstrates of FIGS. 27 and 28.

The figures are not necessarily to scale. Like numbers used in thefigures refer to like components. However, it will be understood thatthe use of a number to refer to a component in a given figure is notintended to limit the component in another figure labeled with the samenumber.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

In the following description, reference is made to the accompanying setof drawings that form a part hereof and in which are shown by way ofillustration several specific embodiments. It is to be understood thatother embodiments are contemplated and may be made without departingfrom the scope or spirit of the present invention. The followingdetailed description, therefore, is not to be taken in a limiting sense.

All scientific and technical terms used herein have meanings commonlyused in the art unless otherwise specified. The definitions providedherein are to facilitate understanding of certain terms used frequentlyherein and are not meant to limit the scope of the present disclosure.

Unless otherwise indicated, all numbers expressing feature sizes,amounts, and physical properties used in the specification and claimsare to be understood as being modified in all instances by the term“about.” Accordingly, unless indicated to the contrary, the numericalparameters set forth in the foregoing specification and attached claimsare approximations that can vary depending upon the desired propertiessought to be obtained by those skilled in the art utilizing theteachings disclosed herein.

The recitation of numerical ranges by endpoints includes all numberswithin that range (e.g. 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and5) and any range within that range.

As used in this specification and the appended claims, the singularforms “a”, “an”, and “the” encompass embodiments having pluralreferents, unless the context clearly dictates otherwise. As used inthis specification and the appended claims, the term “or” is generallyemployed in its sense including “and/or” unless the context clearlydictates otherwise.

As used herein, “visible light transparent” refers to the level oftransmission being at least 60 percent transmissive to at least onepolarization state of visible light, where the percent transmission isnormalized to the intensity of the incident, optionally polarized light.It is within the meaning of visible light transparent for an articlethat transmits at least 60 percent of incident light to includemicroscopic features (e.g., dots, squares, or lines with minimumdimension, e.g. width, between 0.5 and 10 micrometers, or between 1 and5 micrometers) that block light locally to less than 80 percenttransmission (e.g., 0 percent); however, in such cases, for anapproximately equiaxed area including the microscopic feature andmeasuring 1000 times the minimum dimension of the microscopic feature inwidth, the average transmittance is greater than 60 percent.

The present disclosure relates to touch screen sensors with electricaland optical properties that are engineered through design of conductormicropatterns comprised therein. There are several advantages that arecreated for touch screen sensors by the incorporation of the conductormicropatterns described herein. In some embodiments, the transparentconductive properties within a transparent conductive region areengineered to control the electrical potential gradient within the touchsensing region during use. This leads to simplicity of signal processingelectronics and, for some touch screen sensor types simplicity in thedesign of (or elimination of the need for) additional conductor patternsthat would otherwise be needed for electrical potential gradient(electrical field) linearization. In some embodiments, the electricalproperties of the touch screen sensors described herein are designed togenerate a controlled electrical potential gradient along a transparentsensor element. E.g., the electrical properties are designed to create alinear electrical potential gradient along a particular direction withina transparent conductive region, the overall shape of which wouldordinarily lead to a non-linear gradient if a standard transparentconductor material was used (e.g., continuous ITO coating). In someembodiments, the electrical properties are designed to create a level ofnon-linearity of electrical potential gradient for a transparentconductive region that is greater than that which would be presentwithin a transparent conductive region of the same shape but comprisedof a standard transparent conductor material (e.g., continuous ITOcoating). In more detail, for a rectangular capacitive touch screencomprising a contiguous transparent sheet conductor in the form of amicropatterned conductor with electrical connections made to the cornersof the sensing area, the linearity of electrical potential gradient (anduniformity of electric field) across the sensing area in the verticaland horizontal directions can be improved by engineering the areadistribution of sheet resistance values and anisotropy in such a way asto distribute the field more uniformly. In other embodiments, the sensorincludes conductor elements comprised of the same conductor material atthe same thickness (i.e., height), but with different effective sheetresistance by virtue of micropatterning. E.g., in some embodiments, thesame conductor material at the same thickness (i.e., height) is used togenerate conductive traces that define a first micropattern geometry,leading to a first level of sheet resistance in a transparent conductiveregion, and conductive traces that define a second micropatterngeometry, leading to a second level of sheet resistance in a secondtransparent conductive region. This disclosure also allows for improvedefficiency and resource utilization in the manufacture of transparentdisplay sensors, e.g. through the avoidance of rare elements such asindium for some embodiments, e.g. embodiments based on micropatternedmetal conductors.

The disclosure further relates to contact or proximity sensors for touchinput of information or instructions into electronic devices (e.g.,computers, cellular telephones, etc.) These sensors are visible lighttransparent and useful in direct combination with a display, overlayinga display element, and interfaced with a device that drives the display(as a “touch screen” sensor). The sensor element has a sheet like formand includes at least one electrically insulating visible lighttransparent substrate layer that supports one or more of the following:i) conductive material (e.g., metal) that is mesh patterned onto twodifferent regions of the substrate surface with two different meshdesigns so as to generate two regions with different effective sheetresistance values, where at least one of the regions is a transparentconductive region that lies within the touch-sensing area of the sensor;ii) conductive material (e.g., metal) that is patterned onto the surfaceof the substrate in a mesh geometry so as to generate a transparentconductive region that lies within the touch sensing area of the sensorand that exhibits anisotropic effective sheet resistance; and/or iii)conductive material (e.g., metal) that is patterned onto the surface ofthe substrate in a mesh geometry within an effectively electricallycontinuous transparent conductive region, the geometry varying withinthe region so as to generate different values of local effective sheetresistance in at least one direction (e.g., continuously varying sheetresistance for the transparent conductive region), where the region lieswithin the sensing area of the touch sensor.

The sensing area of a touch sensor is that region of the sensor that isintended to overlay, or that overlays, a viewable portion of aninformation display and is visible light transparent in order to allowviewability of the information display. Viewable portion of theinformation display refers to that portion of an information displaythat has changeable information content, e.g. the portion of a display“screen” that is occupied by pixels, e.g. the pixels of a liquid crystaldisplay.

This disclosure further relates to touch screen sensors that are of theresistive, capacitive, and projected capacitive types. The visible lighttransparent conductor micropatterns are particularly useful forprojected capacitive touch screen sensors that are integrated withelectronic displays. As a component of projected capacitive touch screensensors, the visible light transparent conductive micropattern areuseful for enabling high touch sensitivity, multi-touch detection, andstylus input.

The two or more different levels of sheet resistance, the anisotropy ofthe sheet resistance, or the varying level of sheet resistance within atransparent conductive region can be controlled by the geometries oftwo-dimensional meshes that make up the transparent micropatternedconductors, as described below.

While the present invention is not so limited, an appreciation ofvarious aspects of the invention will be gained through a discussion ofthe examples provided below.

FIG. 1 illustrates a schematic diagram of a touch screen sensor 100. Thetouch screen sensor 100 includes a touch screen panel 110 having a touchsensing area 105. The touch sensing area 105 is electrically coupled toa touch sensor drive device 120. The touch screen panel 110 isincorporated into a display device.

FIG. 2 illustrates a perspective view of a conductive visible lighttransparent region 101 that would lie within a touch sensing area of atouch screen panel, e.g., touch sensing area 105 in FIG. 1. Theconductive visible light transparent region 101 includes a visible lighttransparent substrate 130 and an electrically conductive micropattern140 disposed on or in the visible light transparent substrate 130. Thevisible light transparent substrate 130 includes a major surface 132 andis electrically insulating. The visible light transparent substrate 130can be formed of any useful electrically insulating material such as,e.g., glass or polymer. Examples of useful polymers for lighttransparent substrate 130 include polyethylene terephthalate (PET) andpolyethylene naphthalate (PEN). The electrically conductive micropattern140 can be formed of a plurality of linear metallic features.

FIG. 2 also illustrates an axis system for use in describing theconductive visible light transparent region 101 that would lie within atouch sensing area of a touch screen panel. Generally, for displaydevices, the x and y axes correspond to the width and length of thedisplay and the z axis is typically along the thickness (i.e., height)direction of a display. This convention will be used throughout, unlessotherwise stated. In the axis system of FIG. 2, the x axis and y axisare defined to be parallel to a major surface 132 of the visible lighttransparent substrate 130 and may correspond to width and lengthdirections of a square or rectangular surface. The z axis isperpendicular to that major surface and is typically along the thicknessdirection of the visible light transparent substrate 130. A width of theplurality of linear metallic features that form the electricallyconductive micropattern 140 correspond to an x-direction distance forthe parallel linear metallic features that extend linearly along the yaxis and a y-direction distance for the orthogonal linear metallicfeatures correspond to a width of the orthogonal linear metallicfeatures. A thickness or height of the linear metallic featurescorresponds to a z-direction distance.

In some embodiments, the conductive visible light transparent region 101that would lie within a touch sensing area of a touch screen panelincludes two or more layers of visible light transparent substrate 130each having a conductive micropattern 140.

The conductive micropattern 140 is deposited on the major surface 132.Because the sensor is to be interfaced with a display to form a touchscreen display, or touch panel display, the substrate 130 is visiblelight transparent and substantially planar. The substrate and the sensormay be substantially planar and flexible. By visible light transparent,what is meant is that information (e.g., text, images, or figures) thatis rendered by the display can be viewed through the touch sensor. Theviewability and transparency can be achieved for touch sensors includingconductors in the form of a deposited metal, even metal that isdeposited with thickness great enough to block light, if the metal isdeposited in an appropriate micropattern.

The conductive micropattern 140 includes at least one visible lighttransparent conductive region overlaying a viewable portion of thedisplay that renders information. By visible light transparentconductive, what is meant is that the portion of the display can beviewed through the region of conductive micropattern and that the regionof micropattern is electrically conductive in the plane of the pattern,or stated differently, along the major surface of the substrate ontowhich the conductive micropattern is deposited and to which it isadjacent. Preferred conductive micropatterns include regions with twodimensional meshes, e.g. square grids, rectangular (non-square) grids,or regular hexagonal networks, where conductive traces define enclosedopen areas within the mesh that are not deposited with conductor that isin electrical contact with the traces of the mesh. The open spaces andassociated conductor traces at their edges are referred to herein ascells. Other useful geometries for mesh cells include random cell shapesand irregular polygons.

In some embodiments, the conductive traces defining the conductivemicropattern are designed not to include segments that are approximatelystraight for a distance greater than the combined edge length of fiveadjacent cells, preferably four adjacent cells, more preferably threeadjacent cells, even more preferably two adjacent cells. Mostpreferably, the traces defining the micropattern are designed not toinclude segments that are straight for a distance greater than the edgelength of a single cell. Accordingly, in some embodiments, the tracesthat define the micropattern are not straight over long distances, e.g.,10 centimeters, 1 centimeter, or even 1 millimeter. Patterns withminimal lengths of straight line segments, as just described, areparticularly useful for touch screen sensors with the advantage ofcausing minimal disturbance of display viewability.

The two-dimensional geometry of the conductive micropattern (that is,geometry of the pattern in the plane or along the major surface of thesubstrate) can be designed, with consideration of the optical andelectrical properties of the conductor material, to achieve specialtransparent conductive properties that are useful in touch screensensors. E.g., whereas a continuous (un-patterned) deposit or coating ofconductor material has a sheet resistance that is calculated as its bulkresistivity divided by its thickness, in the present invention differentlevels of sheet resistance are engineered by micropatterning theconductor as well.

In some embodiments, the two-dimensional conductive micropattern isdesigned to achieve anisotropic sheet resistance in a conductive region(e.g., a visible light transparent conductive region) of the sensor. Byanisotropic sheet resistance, what is meant is that the magnitude of thesheet resistance of the conductive micropattern is different whenmeasured or modeled along two orthogonal directions.

In contrast, in some embodiments, the two-dimensional conductivemicropattern is designed to achieve isotropic sheet resistance in aconductive region (e.g., a visible light transparent conductive region)of the sensor. By isotropic sheet resistance, what is meant is that themagnitude of the sheet resistance of the conductive micropattern is thesame when measured or modeled along any two orthogonal directions in theplane, as in the case for a square grid formed with traces of constantwidth for both directions.

Anisotropic sheet resistance within a region can include sheetresistance in one direction that is at least 10 percent greater than thesheet resistance in the orthogonal direction, or at least 25 percentgreater, at least 50 percent greater, at least 100 percent greater, atleast 200 percent greater, at least 500 percent greater, or even atleast 10 times greater. In some embodiments, anisotropic sheetresistance within a region includes sheet resistance in one directionthat is greater than the sheet resistance in the orthogonal direction bya factor of at least 1.5. In some embodiments, anisotropic sheetresistance within a region includes sheet resistance in one directionthat is greater than the sheet resistance in the orthogonal direction bya factor between 1.1 and 10, in other embodiments between 1.25 and 5,and in yet other embodiments between 1.5 and 2.

An example of a conductive micropattern geometry that can generateanisotropic sheet resistance is approximately a rectangular microgrid(non-square) with fixed widths for the conductive traces. For such arectangular microgrid (non-square), anisotropic sheet resistance canresult from a repeating geometry for the cells of the grid that includesone edge that is 10 percent longer than the other, 25 percent longerthan the other, at least 50 percent longer than the other, 100 percentlonger than the other, or even 10 times longer than the other.Anisotropic sheet resistance can be created by varying the width oftraces for different directions, e.g. in an otherwise highly symmetricalpattern of cells for a mesh. An example of the latter approach togenerating anisotropic sheet resistance is a square grid of conductivetraces, e.g. with pitch of 200 micrometers, wherein the traces in afirst direction are 10 micrometers wide and the traces in the orthogonaldirection are 9 micrometers in width, 7.5 micrometers in width, 5micrometers in width, or even 1 micrometer in width. Anisotropic sheetresistance within a region can include a finite, measurable sheetresistance in one direction and essentially infinite sheet resistance inthe other direction, as would be generated by a pattern of parallelconductive lines. In some embodiments, as described above, theanisotropic sheet resistance within a region includes a finite,measurable sheet resistance in a first direction and a finite,measurable sheet resistance in the direction orthogonal to the firstdirection.

For the purpose of determining whether a region of conductivemicropattern is isotropic or anisotropic, it will be appreciated bythose skilled in the art that the scale of the region of interest mustbe reasonably selected, relative to the scale of the micropattern, tomake relevant measurements or calculations of properties. E.g., once aconductor is patterned at all, it is trivial for one to select alocation and a scale on which to make a measurement that will yield adifference in sheet resistance for different directions of measurement.The following detailed example can make the point more clearly. If oneconsidered a conductor pattern of isotropic geometry in the form of asquare grid with 100 micrometer wide conductor traces and 1 millimeterpitch (leading to 900 micrometer by 900 micrometer square openings inthe grid), and one made four point probe measurements of sheetresistance within one of the traces along the edge of a square openingwith a probe having fixed spacing along the four linearly arrangedprobes of 25 micrometers (leading to a separation between the twocurrent probes, the outside probes, of 75 micrometers), different levelsof sheet resistance will be calculated by the measured values of currentand voltage depending on whether the probes were aligned parallel to thetrace or orthogonal to the trace. Thus, even though the square gridgeometry would yield isotropic sheet resistance on a scale larger thanthe square grid cell size, it is possible for one to carry outmeasurements of sheet resistance that would suggest anisotropy. Thus,for the purpose of defining anisotropy of the sheet resistance of aconductive micropattern in the current disclosure, e.g. a visible lighttransparent conductive region of the micropattern that comprises a mesh,the relevant scale over which the sheet resistance should be measured ormodeled is greater than the length scale of a cell in the mesh,preferably greater than the length scale of two cells. In some cases,the sheet resistance is measured or modeled over the length scale offive or more cells in the mesh, to show that the mesh is anisotropic inits sheet resistance.

In contrast to embodiments where the conductive micropattern exhibitsanisotropy of sheet resistance in a region, sensors includingtransparent conducting oxide thin films (e.g., indium tin oxide, or ITO)exhibit isotropic sheet resistance in contiguous regions of theconductor. In the latter case, one can measure or model that asfour-point probe measurements of sheet resistance of a contiguous regionare made in different directions and with decreasing spacing between theprobes, the same readings of current and voltage for differentdirections clearly indicate isotropy.

In some embodiments, the two-dimensional conductive micropattern isdesigned to achieve different levels, or magnitudes, of sheet resistancein two different patterned conductor regions of the sensor, whenmeasured in a given direction. E.g., with respect to the differentlevels of sheet resistance, the greater of the two may exceed the lesserby a factor greater than 1.25, a factor greater than 1.5, a factorgreater than 2, a factor greater than 5, a factor greater than 10, oreven a factor greater than 100. In some embodiments, the greater of thetwo sheet resistance values exceeds the lesser by a factor between 1.25and 1000, in other embodiments between 1.25 and 100, in otherembodiments between 1.25 and 10, in other embodiments between 2 and 5.For a region to be regarded as having a different sheet resistance fromthat of another region, it would have a sheet resistance that is greateror lesser than that of the other region by a factor of at least 1.1.

In some embodiments, the micropattern is designed to achieve theaforementioned different levels of sheet resistance for two patternedconductor regions that are electrically contiguous, which is to say thatthey are patterned conductor regions that are in electrical contact witheach other along a boundary between them. Each of the two patternedconductor regions that share a conductive boundary may have uniformrespective pattern geometries, but again different. In some embodiments,the micropattern is designed to achieve the different levels of sheetresistance for two different patterned conductor regions that areelectrically noncontiguous, which is to say that the they are patternedconductor regions that share no boundary between them for which thepatterned regions are in electrical contact along that boundary. Each ofthe two patterned conductor regions that share no conductive boundarybetween them may have uniform respective pattern geometries, but againdifferent. For electrically noncontiguous regions, it is within thescope of the disclosure for them both to make electrical contact in thepattern to the same solid conductor element, e.g. a bus bar or pad. Insome embodiments, the micropattern is designed to achieve the differentlevels of sheet resistance for two regions that are electricallyisolated from each other and thus can be addressed independently byelectrical signals. Each of the two mesh regions that are electricallyisolated may have a uniform pattern geometry, but again different.Finally, in some embodiments, the micropattern is designed to achievedifferent levels of sheet resistance for two different regions bycreating continuously varying sheet resistance from the first region tothe second, and example of two regions that are electrically contiguous.

The two dimensional conductive micropatterns that include two regionswith different sheet resistance in a measurement direction are usefulfor designing a visible light transparent conductive region in thesensing area with a preferred level of sheet resistance for that region(e.g., low sheet resistance between 5 and 100 ohms per square),including varying or anisotropic sheet resistance optionally, anddesigning an electrical element, e.g. a resistor element, as part of thetouch screen sensor that may or may not lie within the sensing area, theresistor element comprising a sheet conductor with sheet resistanceselected optimally for the resistor function (e.g., higher sheetresistance between 150 and 1000 ohms per square) and possibly in lightof other design constraints, e.g. the constraint of minimizing thefootprint of the resistor.

The sheet resistance of the conductive micropattern, in regions anddirections with finite sheet resistance that can be measured or modeled,as described above, may fall within the range of 0.01 ohms per square to1 megaohm per square, or within the range of 0.1 to 1000 ohms persquare, or within the range of 1 to 500 ohms per square. In someembodiments, the sheet resistance of the conductive micropattern fallswithin the range of 1 to 50 ohms per square. In other embodiments, thesheet resistance of the conductive micropattern falls within the rangeof 5 to 500 ohms per square. In other embodiments, the sheet resistanceof the conductive micropattern falls within the range of 5 to 100 ohmsper square. In other embodiments, the sheet resistance of the conductivemicropattern falls within the range of 5 to 40 ohms per square. In otherembodiments, the sheet resistance of the conductive micropattern fallswithin the range of 10 to 30 ohms per square. In prescribing the sheetresistance that may characterize a conductive micropattern or a regionof a conductive micropattern, the micropattern or region of micropatternis said to have a sheet resistance of a given value if it has that sheetresistance value for electrical conduction in any direction.

Appropriate micropatterns of conductor for achieving transparency of thesensor and viewability of a display through the sensor have certainattributes. First of all, regions of the conductive micropattern throughwhich the display is to be viewed should have an area fraction of thesensor that is shadowed by the conductor of less than 50%, or less than25%, or less than 20%, or less than 10%, or less than 5%, or less than4%, or less than 3%, or less than 2%, or less than 1%, or in a rangefrom 0.25 to 0.75%, or less than 0.5%.

The open area fraction (or open area or Percentage of Open Area) of aconductive micropattern, or region of a conductive micropattern, is theproportion of the micropattern area or region area that is not shadowedby the conductor. The open area is equal to one minus the area fractionthat is shadowed by the conductor, and may be expressed conveniently,and interchangeably, as a decimal or a percentage. Area fraction that isshadowed by conductor is used interchangeably with the density of linesfor a micropatterned conductor. Micropatterned conductor is usedinterchangeably with electrically conductive micropattern and conductivemicropattern. Thus, for the values given in the above paragraph for thefraction shadowed by conductor, the open area values are greater than50%, greater than 75%, greater than 80%, greater than 90%, greater than95%, greater than 96%, greater than 97%, greater than 98%, greater than99%, 99.25 to 99.75%, 99.8%, 99.85%, 99.9% and even 99.95. In someembodiments, the open area of a region of the conductor micropattern(e.g., a visible light transparent conductive region) is between 80% and99.5%, in other embodiments between 90% and 99.5%, in other embodimentsbetween 95% and 99%, in other embodiments between 96% and 99.5%, inother embodiments between 97% and 98%, and in other embodiments up to99.95%. With respect to the reproducible achievement of useful opticalproperties (e.g. high transmission and invisibility of conductivepattern elements) and electrical properties, using practicalmanufacturing methods, preferred values of open area are between 90 and99.5%, more preferably between 95 and 99.5%, most preferably between 95and 99.95%.

To minimize interference with the pixel pattern of the display and toavoid viewability of the pattern elements (e.g., conductor lines) by thenaked eye of a user or viewer, the minimum dimension of the conductivepattern elements (e.g., the width of a line or conductive trace) shouldbe less than or equal to approximately 50 micrometers, or less than orequal to approximately 25 micrometers, or less than or equal toapproximately 10 micrometers, or less than or equal to approximately 5micrometers, or less than or equal to approximately 4 micrometers, orless than or equal to approximately 3 micrometers, or less than or equalto approximately 2 micrometers, or less than or equal to approximately 1micrometer, or less than or equal to approximately 0.5 micrometer.

In some embodiments, the minimum dimension of conductive patternelements is between 0.5 and 50 micrometers, in other embodiments between0.5 and 25 micrometers, in other embodiments between 1 and 10micrometers, in other embodiments between 1 and 5 micrometers, in otherembodiments between 1 and 4 micrometers, in other embodiments between 1and 3 micrometers, in other embodiments between 0.5 and 3 micrometers,and in other embodiments between 0.5 and 2 micrometers. With respect tothe reproducible achievement of useful optical properties (e.g. hightransmission and invisibility of conductive pattern elements with thenaked eye) and electrical properties, and in light of the constraint ofusing practical manufacturing methods, preferred values of minimumdimension of conductive pattern elements are between 0.5 and 5micrometers, more preferably between 1 and 4 micrometers, and mostpreferably between 1 and 3 micrometers.

In general, the deposited electrically conductive material reduces thelight transmission of the touch sensor, undesirably. Basically, whereverthere is electrically conductive material deposited, the display isshadowed in terms of its viewability by a user. The degree ofattenuation caused by the conductor material is proportional to the areafraction of the sensor or region of the sensor that is covered byconductor, within the conductor micropattern.

In general, it is desirable for a transparent touch screen sensor toexhibit a low value of haze. Haze refers to a property related to thescattering of light as it passes through a medium, e.g. as measured by aHaze-Gard instrument (Haze-Gard plus, BYK Gardner, Columbia, Md.). Insome embodiments, the touch screen sensor exhibits haze less than 10%,in some embodiments less than 5%, in some embodiments less than 4%, insome embodiments less than 3%, in some embodiments less than 2%.Embodiments are disclosed which achieve a desirable combination of hightransmission (also referred to as visible light transmittance), lowhaze, and low conductor trace visibility for regions including conductormicropatterns. The conductor micropatterns are thus especially usefulwhen used as part of a sensing area or region of a touch screen sensordisplay, e.g. when the micropattern overlays a viewable region of thedisplay.

In some embodiments, in order to generate a visible light transparentdisplay sensor that has uniform light transmission across the viewabledisplay field, even if there is a non-uniform distribution of sheetresistance, e.g. derived from a non-uniform mesh of conductive material,the sensors include isolated conductor deposits added to the conductormicropattern that serve to maintain the uniformity of lighttransmittance across the pattern. Such isolated conductor deposits arenot connected to the drive device (e.g., electrical circuit or computer)for the sensor and thus do not serve an electrical function. Forexample, a metal conductor micropattern that includes a first regionwith a mesh of square grid geometry of 3 micrometer line width and 200micrometer pitch (3% of the area is shadowed by the metal, i.e., 97%open area) and second region with a mesh of square grid geometry of 3micrometer line width and 300 micrometer pitch (2% of the area isshadowed by the metal, i.e., 98% open area) can be made opticallyuniform in its average light transmission across the two regions byincluding within each of the open cells of the 300 micrometer pitch gridregion one hundred evenly spaced 3 micrometer by 3 micrometer squares ofmetal conductor in the pattern. The one hundred 3 micrometer by 3micrometer squares (900 square micrometers) shadow an additional 1percent of the area for each 300 micrometer by 300 micrometer cell(90000 square micrometers), thus making the average light transmissionof the second region equal to that of the first region. Similar isolatedmetal features can be added in regions of space between contiguoustransparent conductive regions, e.g. contiguous transparent conductiveregions that include micropatterned conductors in the form of twodimensional meshes or networks, in order to maintain uniformity of lighttransmittance across the sensor, including the transparent conductiveregions and the region of space between them. In addition to isolatedsquares of conductor, other useful isolated deposits of conductor fortailoring optical uniformity include circles and lines. The minimumdimension of the electrically isolated deposits (e.g., the edge lengthof a square feature, the diameter of a circular feature, or the width ofa linear feature) is less than 10 micrometers, less than 5 micrometers,less than 2 micrometers, or even less than 1 micrometer.

With respect to the reproducible achievement of useful opticalproperties (e.g. high transmission and invisibility of conductivepattern elements), using practical manufacturing methods, the minimumdimension of the electrically isolated deposits is preferably between0.5 and 10 micrometers, more preferably between 0.5 and 5 micrometers,even more preferably between 0.5 and 4 micrometers, even more preferablybetween 1 and 4 micrometers, and most preferably between 1 and 3micrometers. In some embodiments, the arrangement of electricallyisolated conductor deposits is designed to lack periodicity. A lack ofperiodicity is preferred for limiting unfavorable visible interactionswith the periodic pixel pattern of an underlying display. For anensemble of electrically isolated conductor deposits to lackperiodicity, there need only be a single disruption to the otherwiseperiodic placement of at least a portion of the deposits, across aregion having the deposits and lacking micropattern elements that areconnected to decoding or signal generation and/or processingelectronics. Such electrically isolated conductor deposits are said tohave an aperiodic arrangement, or are said to be an aperiodicarrangement of electrically isolated conductor deposits. In someembodiments, the electrically isolated conductor deposits are designedto lack straight, parallel edges spaced closer than 10 micrometersapart, e.g. as would exist for opposing faces of a square deposit withedge length of 5 micrometers. More preferably the isolated conductordeposits are designed to lack straight, parallel edges spaced closerthan 5 micrometers apart, more preferably 4 micrometers apart, even morepreferably 3 micrometers apart, even more preferably 2 micrometersapart. Examples of electrically isolated conductor deposits that lackstraight, parallel edges are ellipses, circles, pentagons, heptagons,and triangles. The absence within the design of electrically isolatedconductor deposits of straight, parallel edges serves to minimizelight-diffractive artifacts that could disrupt the viewability of adisplay that integrates the sensor.

The impact of the conductor micropattern on optical uniformity can bequantified. If the total area of the sensor, and hence the conductormicropattern, that overlays a viewable region of the display issegmented into an array of 1 millimeter by 1 millimeter regions,preferred sensors include conductor micropatterns wherein none of theregions have a shadowed area fraction that differs by greater than 75percent from the average for all of the regions. More preferably, nonehave a shadowed area fraction that differs by greater than 50 percent.More preferably, none have a shadowed area fraction that differs bygreater than 25 percent. Even more preferably, none have a shadowed areafraction that differs by greater than 10 percent. If the total area ofthe sensor, and hence the conductor micropattern, that overlays aviewable region of the display is segmented into an array of 5millimeter by 5 millimeter regions, preferred sensors include conductormicropatterns wherein none of the regions have a shadowed area fractionthat differs by greater than 50 percent from the average for all of theregions. Preferably, none have a shadowed area fraction that differs bygreater than 50 percent. More preferably, none have a shadowed areafraction that differs by greater than 25 percent. Even more preferably,none have a shadowed area fraction that differs by greater than 10percent.

The disclosure advantageously allows for the use of metals as theconductive material in a transparent conductive sensor, as opposed totransparent conducting oxides (TCO's), such as ITO. ITO has certaindrawbacks, such as corrosion-related degradation in certainconstructions, a tendency to crack when flexed, high attenuation oftransmitted light (due to reflection and absorption) when deposited as acoating with sheet resistance below 100 to 1000 ohms per square, andincreasing cost due to the scarcity of indium. ITO is also difficult todeposit with uniform and reproducible electrical properties, leading tothe need for more complex and expensive electronics that couple to theconductive pattern to construct a touch screen sensor.

Examples of useful metals for forming the electrically conductivemicropattern include gold, silver, palladium, platinum, aluminum,copper, nickel, tin, alloys, and combinations thereof. In someembodiments, the conductor is a transparent conducting oxide. In someembodiments the conductor is ITO. The conductor may have a thicknessbetween 5 nanometers and 5 micrometers, or between 10 nanometers and 500nanometers, or between 15 nanometers and 250 nanometers. In manyembodiments, the thickness of the conductor is less than one micrometer.A desired thickness for the conductor can be calculated by starting withthe desired sheet resistance and considering the micropattern geometry(and in turn its effect on the current-carrying cross-section in theplane) and the bulk resistivity of the conductor, as is known in theart. For complicated geometries of micropattern, there are computationalmethods in the art, e.g. finite difference methods or finite elementmethods that can be used to calculate sheet resistance, referred toherein as modeling the properties of a micropattern. Sheet resistancecan be measured using a number of techniques, including four-point probetechniques and non-contact eddy-current methods, as are known in theart.

Examples of useful displays with which sensors of the invention can beintegrated include liquid crystal displays, cathode ray tube displays,plasma display panels, and organic light emitting diode displays.

Conductor patterns according to the invention can be generated by anyappropriate patterning method, e.g. methods that includephotolithography with etching or photolithography with plating (see,e.g., U.S. Pat. No. 5,126,007; U.S. Pat. No. 5,492,611; U.S. Pat. No.6,775,907). Additionally, the conductor patterns can be createdutilizing one of several other exemplary methods (each discussed in moredetail below):

-   -   1. Laser cured masking (curing of a mask layer on a metal film,        and then etching);    -   2. Inkjet printing (of masking material or of seed material for        subsequent metal plating);    -   3. Gravure printing (of a seed material for subsequent metal        plating);    -   4. Micro-replication (form micro-grooves in a substrate, then        fill with conductive material or with a seed material for        subsequent metal plating); or,    -   5. Micro-contact printing (stamping or rotary printing of        self-assembled monolayer (SAM) patterns on a substrate's        surface).

Utilizing high volume, high resolution printing methods generally allowfor precision placement of the conductive elements, and also allows forthe (pseudo-random) variation of the microconductors at a scalecompatible with commercially available display pixels, to limit opticalanomalies (for example moiré patterns) that might otherwise occur.

Certain embodiments discussed herein may employ flat-sided “wire-like”conductors that enable greater light transmission than existing sensorsthat utilize transparent conductors. These flat-sided “wire-like”conductors, in some embodiments, provide greater scalability and controlof conductor placement than is possible with existing round wiresolutions. Micro-conductors discussed herein include conductors withmaximum cross sectional dimension of 10 micrometers or less. Less than 3micrometers is preferred for many sensor applications. Methods ofutilizing masking and etching typically produce a low-aspect (0.05 to0.5 μm thick×1 μm to 10 μm wide) microconductor. Micro-replicatedgrooves can produce higher aspect ratio microconductors, up to greaterthan 1:1.

Laser cured masking can be used to create microconductors by selectivelycuring a pattern with an ultraviolet laser. Such a process typicallyworks with either film- (for example, PET) or glass-based substrates. Anexemplary laser cured masking process may include the following steps:

-   -   1. A substrate is plated with metal, (for example, silver or        copper is sputter coated onto glass or PET film);    -   2. UV curable masking ink is coated uniformly onto the plated        substrate, (for example, spin coating, and dip coating);    -   3. A laser cures a portion of the printed ink, to form        microconductor electrodes in the active area of the touch        sensor, and may also cure (wider) lines that interconnect        electrodes to connector pads (beam width of the laser may be        reduced by a photo mask);    -   4. Uncured ink is removed (washed off); and    -   5. Metal plated on the substrate is removed by etching, except        for the pattern under the masking ink.

Inkjet Printing and plating of seed ink can be used to createmicroconductors by printing of the desired pattern using relatively widelines of seed ink (catalytic ink), followed by selective curing with aUV laser, and similar to the laser cured masking process describedabove. The substrate for this process may be either film- (for example,PET) or glass.

FIG. 3 a and FIG. 3 b show such a process, whereby:

-   -   1. Seed ink 66 is inkjet printed onto a substrate 67;    -   2. A laser 65 cures a portion of the printed ink, to form        microconductor electrodes 68 in active area(s) of the touch        sensor, and may also cure (wider) lines that interconnect        electrodes to connector pads (the beam width of the laser may be        reduced by a photo mask);    -   3. Uncured ink is removed (washed off); and,    -   4. The cured pattern of seed ink is electroless plated, (with a        conductive metal).

The inkjet printing process minimizes the amount of ink used, so itshould be considered where inks are expensive, (for example, seed inks).If ink has relatively low cost, inkjet printing can be replaced byanother process (for example, spin coating or dip coating) that coatsthe whole substrate uniformly. Ink material and processing for theInkjet printing and plating of seed ink process described above areavailable from Conductive Inkjet Technology division of Carclo TechnicalPlastics, Cambridge, UK.

Gravure printing requires that the image to be printed is “etched” intoa metal plate which rotates on a drum. As the drum turns, the etchedsurface is filled with ink which then gets deposited on the surface ofthe film being printed as the ink-filled etched plate and the filmcontact each other. The process is diagramed in FIG. 4, which shows afilm substrate 76 being printed with ink lines 74 from ink bath 73.Impression cylinder 70 is rolled against printing drum 75, which hasetches 72 that fill with ink from inkbath 73. Such a process could beused to make stock material for later processing or could be used tomake specific X or Y components of a high volume sensor.

Seed inks (or catalytic inks) may be printed by any of the methodsdescribed above. After printing and curing, the inks can be electrolessplated with metals such as copper, resulting in high conductivity. Seedink manufacturers include Conductive Inkjet Technology, a division ofCarclo, located in Cambridge, UK and QinetiQ Company in Farnborough,England. Cabot Printable Electronics and Displays of Albuquerque, N.Mex. make inkjet printable silver conductive inks.

Micro-replication is yet another process that can be used to formmicroconductors. The diagram in FIG. 5 shows a cross sectional view offilled, or partially filled, micro-replicated channels. The channels maybe filled with seed ink 81 and then plated (see metallization layer 80)to make them conductive. Alternatively the channels could be filled withan ink that by itself is conductive, eliminating the need for theplating process. A third alternative is to coat the substrate with ametal, then mask the portions of metal in the (bottom of) the grooves,then etch away the unmasked metal, (see, for example, patentapplications No. 61/076,731 (“Method of Forming a Microstructure”) and61/076,736 (“Method of Forming a Patterned Substrate.”)) The actualshape of the channels can be altered to optimize the cross sectionalshape and size that provides the lowest level of optical interferencewhile still ensuring high conductivity and high production yields.

Filled micro-replicated channels can provide a conductor with a highaspect ratio cross section (relative to masked metal films). Thusmaximum conductivity may be achieved with minimum optical visibility,(narrow cross section in the direction of viewing). A method of fillingmicro-replicated channels and desirable shapes of channels with highaspect ratio are described in co-assigned US patent applicationUS2007/0160811 (Gaides, et. al.).

FIG. 6 shows a cross-profile of a high aspect ratio touch-surface havingmicro-replicated electrodes that are deeper than they are wide. In oneembodiment, a micro-replicated structure that has a ratio of depth towidth greater than 1:1 will yield better performance Generally, thethinner width of the micro-replicated structure will allow more of thelight exiting the display to pass through the touch sensor. Further,deeper rather than wider channels will reduce the surface area that willlimit reflection of light entering the sensor from the first surface.These advantages are gained while not losing capacitive signal. FIG. 6shows a finger 85 capacitively coupling with a printed copper electrodes87 of touch sensor 86 not only to the top surface but also to the sidesof the sensor.

Micro-contact printing is yet another process that can be used to formmicroconductors. Micro-contact printing is the stamping or rotaryprinting of self-assembled monolayer (SAM) patterns on substratesurfaces. The approach exhibits several technologically importantfeatures, including the ability to be carried out for very fine scalepatterns (e.g., feature size of one tenth of a micrometer) and with theextension of the patterned monolayer to the patterning of metals,ceramics, and polymers.

An exemplary micro-contact printing process is as follows:

-   -   1. A substrate is coated with metal, (for example, silver or        copper is sputter coated or plated onto glass or PET film);    -   2. A self-assembled mono-layer mask is stamped onto the plated        substrate; and,    -   3. Metal coated on the substrate is removed by etching, except        for the pattern under the mask.

A micro-contact printing process is described in, for example, U.S. Pat.No. 5,512,131 (Kumar) and in co-pending 3M patent application No.61/032,273 (“Methods of Patterning a Conductor on a Substrate”).Micro-contact printing is generally substrate independent. For example,substrates can be PET, glass, PEN, TAC, or opaque plastic. As is knownin the art, micro-contact printing can be combined with metal depositionprocesses to yield an additive patterning process (for example,including electroless plating).

FIG. 7 a shows a matrix sensor for a small capacitive touch screen. Twopatterns (91 and 92) of electrodes, interconnects, and connector padsare printed on a flexible substrate (for example, PET). The two patternsare then assembled together to form two layers of electrodes on parallelplanes, with electrodes on the top plane orthogonal to conductors on thelower plane as shown (see FIG. 7 b). Sometimes, a shield (not shown) isrequired below the lower electrode plane.

The patterns represented in FIG. 7 may be printed using one of themethods described herein, and a single printing process step was used tosimultaneously print the <10 μm micro-conductors that form electrodes,and the interconnects lines (typically >10 μm) that carry signals fromelectrodes to connector pads, and also the connector pads themselves maybe formed in the same print process. For example, the microcontactprinting process was used to simultaneously print patterns of 3 μmmicroconductors and 500 μm conductive traces 706 as described withrespect to FIG. 27. This particular embodiment yielded severaladvantages:

-   -   1. Alignment of electrodes with interconnects is automatic and        very accurate;    -   2. Interconnects can be printed much narrower and more closely        spaced than with other interconnect printing processes, (for        example, silkscreen printing of conductive inks); and    -   3. The thickness of interconnects (perpendicular to the plane of        the substrate) is much less than with prior interconnect        printing processes, (for example, silkscreen printing of        conductive inks). Thick interconnects cause gaps between        laminated layers which are visible and can undermine the seal        between laminated layers.

FIG. 8 shows the micro-replicated and filled “stock” constructionmaterial with parallel micro-conductors 95 on a substrate 96 surface.Web orientation is verticle (97). The substrate may be PET, PEN, orpolycarbonate, and the micro-conductors may be deposited inmicro-replicated grooves as disclosed herein and/or in 3M patentapplications No. 61/076,731 (“Method of Forming a Microstructure”) and61/076,736 (“Method of Forming a Patterned Substrate”). Spacing ofmicro-conductors is, in one embodiment, preferably between 50 μm and 500μm.

This stock material may be processed into touch sensor components (forexample, electrodes or shields) by interconnecting selectedmicro-conductors with printed (for example, inkjetted, or silkscreened)dielectrics that provide insulating cross-overs whereby post-printed(for example, inkjetted or silkscreened) conductive inks (printed usingthe methods described herein) can bridge over some micro-conductors andmake contact only with selected micro-conductors. Thus interconnects andconnector pads are made for a sensor as shown in FIG. 9, which shows aninkjet-printed dielectric surface 1002 with through-holes 1000 throughthe dielectric, and conductive traces 1001 also printed by inkjet. WhileFIG. 8 and FIG. 9 show micro-conductors printed in the direction of thesubstrate web, it is sometimes advantageous to print micro-conductors ina direction perpendicular to the substrate web.

FIG. 10 shows a cross section of an example of a matrix touch sensorconstructed with two layers of the stock micro-replicatedmicro-conductor material, and two layers of post-printed inkjetconductive traces, separated. The topmost layer 1010 includesmicro-replicated micro-conductors; the next layer 1011 is a printeddielectric; the next layer 1012 includes post-processed conductors; thenext layer 1013 is an adhesive; the next layer 1014 is a post-processedconductor; the next layer 1015 is a printed dielectric, and the finallayer 1016 includes micro-replicated microconductors.

In some embodiments, transparent conductive regions with different sheetresistance in at least one direction are created by including selectivebreaks in conductive traces within an otherwise continuous and uniformmesh. This approach of selective placement of breaks is especiallyuseful for generating articles including patterns of visible transparentconductive regions where the optical transmittance across the article isuniform. The starting mesh can be isotropic or anisotropic. For example,an elongated rectangular transparent conductive bar having a squaremicromesh can be made to exhibit periodic sheet resistance along itslong axis by creating a periodic series of breaks, the breaks being intraces that have a vector component in the direction of the long axisand the periodicity being in the direction of the long axis. Thisperiodicity in sheet resistance can be useful for decoding the positionof an object (e.g., a finger) near the rectangular bar. By selecting thewidth, thickness, and area density of traces, together with thepopulation of breaks, one can design periodic variation in theresistance per unit length along a transparent conductive elementcharacterized by peaks in resistance per unit length that are at least 2times the minimum in resistance per unit length, preferably at least 5times their minimum, more preferably at least 10 times their minimum.

In other embodiments that include selective breaks in an otherwisecontinuous and uniform mesh, the breaks can be placed in order to createapproximately continuously varying sheet resistance in a givendirection. The continuously varying sheet resistance can be useful foramplifying the non-linearity of electric field along a transparentconductive element, beyond that which would be created only by theoverall shape of the element. E.g., as is known in the art, atransparent conductive element with uniform sheet resistance, in theform of an elongated isosceles triangle with an electrical potentialapplied to its base relative to its apex, exhibits non-linear electricfield from base to apex due to the gradient in resistance per unitlength along the field direction (created by the narrowing width of thetriangle). For touch sensors based on interdigitated arrays of suchtriangular transparent conductive elements, it would be advantageous forthe non-linearity in electric field to be even greater, leading togreater signal-to-noise ratio for circuitry used to decode the positionof an object (e.g., a finger) near the array. By selecting the width,thickness, and area density of traces, together with the population ofbreaks, one can design sheet resistance per unit length along atransparent conductive element that increases by a factor of at least1.1 over a distance of 1 centimeter, or at least 1.2, or at least 1.5,or at least 2.

In some embodiments, two transparent conductive regions with differentsheet resistance in at least one direction are created by including ineach of the two regions a contiguous mesh with its own design, each meshnot necessarily including selectively placed breaks. Examples of twomeshes with designs that lead to different values of sheet resistancefor current passing in a single direction, e.g. the x direction in FIG.2, include two meshes with the same thickness (dimension in the zdirection in FIG. 2) of the same conductive material deposit but withdifferent amounts with current-carrying cross-sectional area (y-z planein FIG. 2) per unit width in the y direction. One example of such a pairof mesh regions are two square grid regions each comprising conductivetraces of width 2 micrometers but with different pitch, e.g. 100micrometers and 200 micrometers. Another example of such a pair of meshregions are two rectangular grid regions (non-square, with 100micrometer pitch in the one direction and 200 micrometer pitch in theorthogonal direction) each comprising conductive traces of width 2micrometers but with different orientation, e.g. with the long axes ofthe rectangular cells in the first regions oriented at 90 degrees withrespect to the rectangular cells in the second region.

In some embodiments, the sensors include an insulating visible lighttransparent substrate layer that supports a pattern of conductor, thepattern includes a visible light transparent micropattern region and aregion having a larger feature that is not transparent, wherein thevisible light transparent micropattern region and the larger featureregion include a patterned deposit of the same conductor (e.g., a metal)at approximately the same thickness. The larger feature can take theform of, e.g., a wide conductive trace that makes contact to a visiblelight transparent conductive micropattern region or a pad for makingcontact with an electronic decoding, signal generation, or signalprocessing device. The width of useful larger features, in combinationon the same insulating layer with visible light transparent conductivemicropattern regions, is e.g. between 25 micrometers and 3 millimeters,between 25 micrometers and 1 millimeter, between 25 micrometers and 500micrometers, between 25 micrometers and 250 micrometers, or between 50micrometers and 100 micrometers.

One illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea and a second region micropattern. The electrically conductivemicropattern includes metallic linear electrically conductive featureshaving a thickness of less than 500 nanometers and a width between 0.5and 5 micrometers. The first region micropattern has a first sheetresistance value in a first direction between 5 and 500 ohm per square,is visible light transparent, and has between 95% and 99.5% open area.The second region micropattern has a second sheet resistance value inthe first direction that is different than the first sheet resistancevalue.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The electrically conductive micropattern includes metallic linearelectrically conductive features having a thickness of less than 500nanometers and a width between 0.5 and 5 micrometers. The first regionmicropattern has an anisotropic first sheet resistance with a differencein sheet resistance values for orthogonal directions of a factor of atleast 1.5, is visible light transparent, and has between 95% and 99.5%open area.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea and a second region micropattern. The electrically conductivemicropattern includes metallic linear electrically conductive featureshaving a thickness of less than 500 nanometers and a width between 1 and4 micrometers. The first region micropattern has a first sheetresistance value in a first direction between 5 and 100 ohm per square,is visible light transparent, and has between 96% and 99.5% open area.The second region micropattern has a second sheet resistance value inthe first direction that is different than the first sheet resistancevalue.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea and a second region micropattern. The electrically conductivemicropattern includes metallic linear electrically conductive featureshaving a thickness of less than 500 nanometers and a width between 0.5and 5 micrometers. The first region micropattern has a first sheetresistance value in a first direction between 5 and 500 ohm per square,is visible light transparent, and has between 95% and 99.5% open area.The second region micropattern has a second sheet resistance value inthe first direction that is different than the first sheet resistancevalue. The micropattern also includes electrically isolated conductordeposits. For all 1 millimeter by 1 millimeter square regions of thesensor that lie in the visible light transparent sensing area, none ofthe regions have a shadowed area fraction that differs by greater than75 percent from the average for all of the regions.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea and a second region micropattern. The electrically conductivemicropattern includes metallic linear electrically conductive featureshaving a thickness of less than 500 nanometers and a width between 0.5and 5 micrometers. The first region micropattern has a first sheetresistance value in a first direction between 5 and 500 ohm per square,is visible light transparent, and has between 95% and 99.5% open area.The second region micropattern has a second sheet resistance value inthe first direction that is different than the first sheet resistancevalue. The micropattern also includes electrically isolated conductordeposits. For all 5 millimeter by 5 millimeter square regions of thesensor that lie in the visible light transparent sensing area, none ofthe regions have a shadowed area fraction that differs by greater than50 percent from the average for all of the regions.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The electrically conductive micropattern includes metallic linearelectrically conductive features having a thickness of less than 500nanometers and a width between 1 and 4 micrometers. The first regionmicropattern has an anisotropic first sheet resistance with a differencein sheet resistance values for orthogonal directions of a factor of atleast 1.5, is visible light transparent, and has between 96% and 99.5%open area.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The electrically conductive micropattern includes metallic linearelectrically conductive features having a thickness of less than 500nanometers and a width between 0.5 and 5 micrometers. The first regionmicropattern has an anisotropic first sheet resistance with a differencein sheet resistance values for orthogonal directions of a factor of atleast 1.5, is visible light transparent, and has between 95% and 99.5%open area. The micropattern also includes electrically isolatedconductor deposits. For all 1 millimeter by 1 millimeter square regionsof the sensor that lie in the visible light transparent sensing area,none of the regions have a shadowed area fraction that differs bygreater than 75% from the average for all of the regions.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The electrically conductive micropattern includes metallic linearelectrically conductive features having a thickness of less than 500nanometers and a width between 0.5 and 5 micrometers. The first regionmicropattern has an anisotropic first sheet resistance with a differencein sheet resistance values for orthogonal directions of a factor of atleast 1.5, is visible light transparent, and has between 95% and 99.5%open area. The micropattern also includes electrically isolatedconductor deposits. For all 5 millimeter by 5 millimeter square regionsof the sensor that lie in the visible light transparent sensing area,none of the regions have a shadowed area fraction that differs bygreater than 50 percent from the average for all of the regions.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The first region micropattern includes metallic linearelectrically conductive features having a width between 0.5 and 5micrometers. The first region micropattern is visible light transparent,and has between 95% and 99.5% open area. For all 1 millimeter by 1millimeter square regions of the first region micropattern, none of thesquare regions have a shadowed area fraction that differs by greaterthan 75 percent from the average for all of the square regions. In oneembodiment the first region micropattern also includes electricallyisolated conductor deposits. In one embodiment, the metallic linearelectrically conductive features have a thickness of less than 500nanometers. In one embodiment, the first region micropattern has a firstsheet resistance value in a first direction between 5 and 100 ohm permeter.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The first region micropattern includes metallic linearelectrically conductive features having a width between 0.5 and 5micrometers. The first region micropattern is visible light transparent,and has between 95% and 99.5% open area. For all 5 millimeter by 5millimeter square regions of the first region micropattern, none of thesquare regions have a shadowed area fraction that differs by greaterthan 50 percent from the average for all of the square regions. In oneembodiment, the metallic linear electrically conductive features have athickness of less than 500 nanometers. In one embodiment, the firstregion micropattern also includes electrically isolated conductordeposits.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The electrically conductive micropattern includes metallic linearelectrically conductive features having a thickness of less than 500nanometers and a width between 0.5 and 5 micrometers. The first regionmicropattern has a first sheet resistance value in a first directionbetween 5 and 100 ohm per square, is visible light transparent, and hasbetween 95% and 99.5% open area. The micropattern also includeselectrically isolated conductor deposits. For all 1 millimeter by 1millimeter square regions of the sensor that lie in the visible lighttransparent sensing area, none of the regions have a shadowed areafraction that differs by greater than 75 percent from the average forall of the regions.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The electrically conductive micropattern includes metallic linearelectrically conductive features having a thickness of less than 500nanometers and a width between 0.5 and 5 micrometers. The first regionmicropattern has a first sheet resistance value in a first directionbetween 5 and 100 ohm per square, is visible light transparent, and hasbetween 95% and 99.5% open area. The micropattern also includeselectrically isolated conductor deposits. For all 5 millimeter by 5millimeter square regions of the sensor that lie in the visible lighttransparent sensing area, none of the regions have a shadowed areafraction that differs by greater than 50 percent from the average forall of the regions.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea and a second region micropattern. The electrically conductivemicropattern includes metallic linear electrically conductive featureshaving a thickness of less than 500 nanometers and a width between 0.5and 5 micrometers. The first region micropattern has a first sheetresistance value in a first direction between 5 and 500 ohm per square,is visible light transparent, and has between 95% and 99.5% open area.The second region micropattern has a second sheet resistance value inthe first direction that is different than the first sheet resistancevalue. The sensor also includes larger electrically conductive featuresdisposed on or in the visible light transparent substrate, the largerfeatures comprising a continuous conductor deposit of the same materialand thickness as included in the micropattern and measuring at least 25micrometers in minimum dimension.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The electrically conductive micropattern includes metallic linearelectrically conductive features having a thickness of less than 500nanometers and a width between 0.5 and 5 micrometers. The first regionmicropattern has an anisotropic first sheet resistance with a differencein sheet resistance values for orthogonal directions of a factor of atleast 1.5, is visible light transparent, and has between 95% and 99.5%open area. The sensor also includes larger electrically conductivefeatures disposed on or in the visible light transparent substrate, thelarger features comprising a continuous conductor deposit of the samematerial and thickness as included in the micropattern and measuring atleast 25 micrometers in minimum dimension.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea and a second region micropattern. The electrically conductivemicropattern includes metallic linear electrically conductive featureshaving a thickness of less than 500 nanometers and a width between 0.5and 5 micrometers. The first region micropattern has a first sheetresistance value in a first direction between 5 and 500 ohm per square,is visible light transparent, and has between 95% and 99.5% open area.The second region micropattern has a second sheet resistance value inthe first direction that is different than the first sheet resistancevalue. The sensor also includes larger electrically conductive featuresdisposed on or in the visible light transparent substrate, the largerfeatures comprising a continuous conductor deposit of the same materialand thickness as included in the micropattern and measuring at least 500micrometers in minimum dimension.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The electrically conductive micropattern includes metallic linearelectrically conductive features having a thickness of less than 500nanometers and a width between 0.5 and 5 micrometers. The first regionmicropattern has an anisotropic first sheet resistance with a differencein sheet resistance values for orthogonal directions of a factor of atleast 1.5, is visible light transparent, and has between 95% and 99.5%open area. The sensor also includes larger electrically conductivefeatures disposed on or in the visible light transparent substrate, thelarger features comprising a continuous conductor deposit of the samematerial and thickness as included in the micropattern and measuring atleast 500 micrometers in minimum dimension.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The first region micropattern includes conductive traces withwidth between 0.5 and 10 micrometers. The first region micropattern isvisible light transparent and has between 90% and 99.95% open area,preferably between 95% and 99.95% open area, and more preferably between97% and 98% open area. For all 5 millimeter by 5 millimeter squareregions of the first region micropattern, none of the square regionshave a shadowed area fraction that differs by greater than 75%,preferably differs by greater than 50%, more preferably differs bygreater than 25%, and most preferably differs by greater than 10% fromthe average for all the square regions. In one embodiment, the firstregion micropattern includes conductive traces with width between 0.5and 5 micrometers, preferably between 1 and 3 micrometers.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The first region micropattern includes conductive traces withwidth between 1 and 10 micrometers. The first region micropattern isvisible light transparent and has between 90% and 99.5% open area. Thefirst region micropattern includes selective breaks in conductive traceswithin an otherwise continuous and uniform mesh.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The first region micropattern includes conductive traces withwidth of about [X+0.5] in units of micrometers and an open area fractionbetween [95−X]% and 99.5%. wherein 0≦X≦4.5. In one embodiment, the touchscreen sensor within the first region micropattern exhibits a haze valueless than 10% and transmission greater than 75%. In another embodimentthe touch screen sensor within the first region micropattern exhibits ahaze value less than 5% and transmission greater than 85%. In oneembodiment, the first region micropattern includes conductive traceswith width of about [98.5−(2.5X÷3.5)]% and [99.5−(X÷3.5)]% wherein0≦X≦3.5.

Another illustrative touch screen sensor includes a visible lighttransparent substrate and an electrically conductive micropatterndisposed on or in the visible light transparent substrate. Themicropattern includes a first region micropattern within a touch sensingarea. The first region micropattern includes parallel conductive tracesspaced 4 mm apart with width of about 9.6 um, yielding an open areafraction of 99.75%. This embodiment of microreplicated electrodescomprises parallel conductors with a width of about 4 um, to 10 um,separated by a distance of 0.5 mm to about 5 mm center to center.Conductors may be formed lengthwise to a web of PET substrate, solengths of conductors may be greater than 1 m. Groups of adjacentconductors may be electrically interconnected to form electrodes of 1 mmto 12 mm total width, for example, using the process described withrespect to FIG. 8 and FIG. 9. Conductors of adjacent electrodes may beinterconnected such that electrodes are interleaved as disclosed in, forexample, co-pending US Patent Application Publication No. 2007/0074914.

EXAMPLES

The following describe exemplary touch screen sensor designs. They canbe fabricated using known photolithographic methods, e.g. as describedin U.S. Pat. No. 5,126,007 or U.S. Pat. No. 5,492,611. The conductor canbe deposited using physical vapor deposition methods, e.g. sputtering orevaporation, as is known in the art. Unless otherwise noted, theexamples below include conductors patterned by a micro-contact printingtechnique (see technique description above and also co-pending U.S.Patent Application No. 61/032,273). Each conductive pattern exemplifiedherein is useful as a transparent touch screen sensor, when connected todecoding circuitry, as is known in the art (e.g., U.S. Pat. No.4,087,625; U.S. Pat. No. 5,386,219; U.S. Pat. No. 6,297,811; WO2005/121940 A2).

Example 1

A micropattern of thin film gold according to the following descriptionis deposited onto a thin sheet of colorless glass (approximately 1millimeter in thickness). The micropattern 240 is depicted in FIG. 11and FIG. 12. The thickness or height of the gold layer is about 100nanometers. The micropattern 240 involves a series of horizontal(x-axis) mesh bars 241 comprising horizontal narrow traces 242, thetraces 242 measuring approximately 2 micrometers in width. Four of thesehorizontal mesh traces 242 are in electrical communication with a largerfeature contact pad 260. The mesh bars measure approximately 6millimeters in width. Accordingly, with thirteen evenly spaced traces244 traversing a width (y-axis) of 6 millimeters and thirteen evenlyspaced traces 242 traversing a length (x-axis) of 6 millimeters, thepitch of the square grid of traces is 500 micrometers. As depicted inFIG. 12, certain traces have breaks 250, measuring approximately 25micrometers (exaggerated in the figures, for ease in locating). For asquare grid with 2 micrometers wide opaque traces on a 500 micrometerpitch, the fill factor for opaque traces is 0.80%, thus leading to anopen area of 99.20%. For the same square grid, except with a 25micrometer break every 500 micrometers, the fill factor is 0.78%, thusleading to an open area of 99.22%. Thus, the design includes 1 mm×6 mmregions with 99.22% open area and 6 mm×6 mm regions with 99.20% openarea. The average visible transmittance of the glass article with meshis approximately 0.92*0.992=91% (with the factor of 0.92 related tointerfacial reflection losses in light transmission in thenon-conductor-deposited areas of the pattern). Along the horizontal bardirection, there is a series of complete grid regions connected togetherby four traces of gold. Assuming an effective bulk resistivity of 5E-06ohm-cm for sputtered thin film gold, each 2 micrometer wide, 500micrometer long segment of thin film gold has a resistance ofapproximately 125 ohms. The regions with a completed grid, for currentpassing in the direction of the bars, have an effective sheet resistanceof approximately 115 ohms per square. The four traces connecting theregions with completed grids create approximately 62.5 ohms ofresistance between the regions. The above described arrangement ofconductive trace elements leads to a spatially varying resistance perunit length along the bar direction as plotted in FIG. 13. FIG. 14illustrates an equivalent circuit for the array of horizontal mesh bars.The circuit has a series of plates connected by resistors.

Example 2

A micropattern of thin film gold according to the following descriptionis deposited onto a thin sheet of colorless glass (approximately 1millimeter in thickness). The micropattern 340 is depicted in FIG. 15.The thickness of the gold is about 100 nanometers. The micropattern 340has transparent conductive regions in the form of a series ofinterdigitated wedges or triangles. Each wedge is comprised of a meshmade up of narrow metallic traces 342, 344, the traces 342, 344 (seeFIG. 15 a-FIG. 15 c) measuring approximately 2 micrometers in width. Themesh wedges measure approximately 1 centimeter in width at their baseand approximately six centimeters in length. The pitch of the squaregrid of traces 342, 344 is 500 micrometers. Within selected regions ofthe mesh (see FIG. 15 a-FIG. 15 b), within a wedge, breaks 350 measuringapproximately 25 micrometers in length are placed intentionally toaffect the local sheet resistance within the wedge, for current passingalong its long axis. As depicted in FIG. 15 a and FIG. 15 b, regions 15a and 15 b (the regions being separated by approximately 1 centimeter inFIG. 15), breaks 350 are included in the mesh that increase the sheetresistance in the direction of the long axis by a factor greater than1.2. The overall design also includes region 15 c (as depicted in FIG.15 c), which is electrically isolated and spaced apart from regions 15 aand 15 b, and which has a mesh of with sheet resistance value less thanthose of regions 15 a and 15 b. The mesh region 15 c has an open area of99.20%, while the mesh regions 15 a and 15 b have open area fractions of99.20% and 99.21% respectively. The overall design also includes regions15 d and 15 e (as depicted in FIG. 15 d and FIG. 15 e) with meshes oflarger pitch than regions 15 a, 15 b and 15 c, but with the same widthof traces, leading to increased sheet resistance and visibletransmittance.

FIG. 16 illustrates the effect of engineering the mesh properties asdescribed above on the gradient in resistance along a wedge, versus theuse of a standard ITO coating for the same shape of region. The overalldesign also includes larger conductive features in the form ofconductive leads along the left and right sides of the pattern, theleads being approximately 1 millimeter wide and patterned from thin filmgold with approximately 100 nanometers thickness.

Example 3

A transparent sensor element 400 for a touch screen sensor isillustrated in FIG. 17. The sensor element 400 includes two patternedconductor layers 410, 414, (e.g., an X axis layer and a Y axis layer)two optically clear adhesive layers 412, 416, and a base plate 418,laminated together and depicted as separated in FIG. 17 for clarity.Layers 410 and 414 include transparent conductive mesh bars where onelayer is oriented in the x axis direction and the other layer isorientated in the y axis direction, with reference to FIG. 2. The baseplate 418 is a sheet of glass measuring 6 centimeter by 6 centimeters inarea and 1 millimeter in thickness. A suitable optically clear adhesiveis Optically Clear Laminating Adhesive 8141 from 3M Company, St. Paul,Minn. For each of the X-layer and the Y-layer, a clear polymer film witha micropattern of metal is used. A micropattern of thin film goldaccording to the following description is deposited onto a thin sheet ofPET. Suitable PET substrates include ST504 PET from DuPont, Wilmington,Del., measuring approximately 125 micrometers in thickness.

The micropattern 440 is depicted in FIG. 18 and FIG. 19. The thicknessof the gold is about 100 nanometers. The micropattern has transparentconductive regions in the form of a series of parallel mesh bars 442. Inaddition to mesh bars that are terminated with square pads 460(approximately 2 millimeters by 2 millimeters in area, comprisingcontinuous conductor in the form of thin film gold with thicknessapproximately 100 nanometers) for connection to an electronic device forcapacitive detection of finger touch to the base plate, there are meshbars 441 that are electrically isolated from the electronic device. Theisolated mesh bars 441 serve to maintain optical uniformity across thesensor. Each bar is comprised of a mesh made up of narrow metallictraces 443, the traces 443 measuring approximately 5 micrometers inwidth. The mesh bars each measure approximately 2 millimeters in widthand 66 millimeters in length. Within each mesh bar are rectangular cellsmeasuring approximately 0.667 millimeters in width and 12 millimeters inlength. This mesh design serves to provide ties between long-axis tracesin each mesh bar, to maintain electrical continuity along the mesh bar,in case of any open-circuit defects in the long axis traces. However, asopposed to the use of a square mesh with 0.667 millimeter pitch havingsuch ties, the rectangular mesh of FIG. 18 and FIG. 19 trades off sheetresistance along the mesh bar with optical transmittance more optimally.More specifically, the mesh bar depicted in FIG. 18 and FIG. 19 and a 2millimeter wide mesh bar comprising a square mesh with 0.667 millimeterpitch would both have essentially the same sheet resistance along thelong axis of the mesh bar (approximately 50 ohms per square); however,the square grid would occlude 1.5% of the area of the transparentconductive region and the mesh depicted in FIG. 18 and FIG. 19 occludesonly 0.8% of the area of the transparent conductive region.

Example 4

A transparent sensor element for a touch screen sensor is described. Thesensor element includes two patterned conductor layers, two opticallyclear adhesive layers, and a base plate as depicted in FIG. 17. The baseplate is a sheet of glass measuring 6 centimeter by 6 centimeters inarea and 1 millimeter in thickness, laminated together as depicted inFIG. 17. A suitable optically clear adhesive is Optically ClearLaminating Adhesive 8141 from 3M Company. For each of the X-layer andthe Y-layer, a clear polymer film with a micropattern of metal is used.A micropattern of thin film gold according to the following descriptionis deposited onto a thin sheet of PET. Suitable PET substrates includeST504 PET from DuPont, measuring approximately 125 micrometers inthickness.

The micropattern 540 is depicted in FIG. 20 and FIG. 21. The thicknessof the gold is 100 nanometers. The micropattern 540 has transparentconductive regions in the form of a series of parallel mesh bars 542. Inaddition to mesh bars 542 that are terminated with square pads 560 forconnection to an electronic device for capacitive detection of fingertouch to the base plate, there are straight line segments 541 that areelectrically isolated from the electronic device. The straight linesegments 541 lie in regions between the mesh bars 542, with essentiallythe same geometry as the mesh bars, except for approximately 25micrometer breaks 550 as depicted in FIG. 13. The isolated line segments541 serve to maintain optical uniformity across the sensor. Each bar 542is comprised of a mesh made up of narrow metallic traces, the tracesmeasuring approximately 5 micrometers in width. The mesh bars 542 eachmeasure approximately 2 millimeters in width and 66 millimeters inlength. Within each mesh bar 542 are rectangular cells measuringapproximately 0.667 millimeters in width and 12 millimeters in length.The mesh 542 depicted in FIG. 12 and FIG. 13 occludes 0.8% of its areawithin the transparent conductive region. The isolated line segments 541depicted in FIG. 12 and FIG. 13 also occlude 0.8% of the area within theregion they occupy between the mesh bars 542.

Example 5

A transparent sensor element for a touch screen sensor is described. Thesensor element includes two patterned conductor layers, two opticallyclear adhesive layers, and a base plate as depicted in FIG. 17. The baseplate is a sheet of glass measuring 6 centimeter by 6 centimeters inarea and 1 millimeter in thickness, laminated together as depicted inFIG. 17. A suitable optically clear adhesive is Optically ClearLaminating Adhesive 8141 from 3M Company. For each of the X-layer andthe Y-layer, a clear polymer film with a micropattern of metal is used.A micropattern of thin film gold according to the following descriptionis deposited onto a thin sheet of PET. Suitable PET substrates includeST504 PET from DuPont, measuring approximately 125 micrometers inthickness.

The micropattern 640 is depicted in FIG. 22 and FIG. 23. The thicknessof the gold is about 100 nanometers. The micropattern 640 hastransparent conductive regions in the form of a series of parallel meshbars 642. In addition to mesh bars 642 that are terminated with squarepads 660 for connection to an electronic device for capacitive detectionof finger touch to the base plate, there are straight line segments 641that are electrically isolated from the electronic device. The straightline segments 641 lie in regions between the mesh bars, with a similargeometry to the line segments of the mesh bars. The electricallyisolated line segments 641 serve to maintain optical uniformity acrossthe sensor. Each bar 641, 642 is comprised of narrow metallic traces,the traces measuring approximately 3 micrometers in width. The mesh bars642 each measure approximately 2 millimeters in width and 66 millimetersin length. Within each mesh bar 642 comprising randomly shaped cells.The mesh 642 depicted in FIG. 22 and FIG. 23 occludes less than 5percent of its area within the transparent conductive region. Theisolated line segments 641 depicted in FIG. 22 and FIG. 23 also occludeless than 5 percent of the area within the region they occupy betweenthe mesh bars.

Preparation of Metalized Polymer Film Substrates e.g.s 6 through 40

A polymer film substrate was provided, polyethyleneterephthalate (PET)(ST504, E. I. DuPont de Nemours and Company, Wilmington, Del.). Theoptical properties of the ST504 PET film were determined by Haze-Gard.The haze and the transmission measured approximately 0.67% and 92.9%,respectively.

Some substrate films were coated with gold and some were coated withsilver. The gold-coated substrates were prepared by thermal evaporation(DV-502A, Denton Vacuum, Moorestown, N.J.). For gold-coated substrates,the substrate surface was first coated with 20 angstroms of chromium andthen coated with 100 nanometers of gold. In the case of silver-coatedsubstrates, two different methods were used. Some silver-coatedsubstrates were prepared by both thermal evaporation (DV-502A, DentonVacuum, Moorestown, N.J.) and some were prepared by sputtering (3M). Thesubstrate surface was coated with 100 nanometers of silver in all cases.

Stamp Fabrication

Two different master tools for molding elastomeric stamps were generatedby preparing patterns of photoresist (Shipley1818, Rohm and HaasCompany, Philadelphia, Pa.) on 10-centimeter diameter silicon wafersusing photolithography. The different master tools were based on twodifferent mesh shapes, herein referred to as “Hex” and “Square”. Hexrefers to a pattern comprising a network of lines that define enclosedareas having the shape of a regular hexagon. Square refers to a patterncomprising a network of lines that define enclosed areas having theshape of squares. An elastomeric stamp was molded against the mastertool by pouring uncured polydimethylsiloxane (PDMS, Sylgard™ 184, DowCorning, Midland, Mich.) over the tool to a thickness of approximately3.0 millimeters. The uncured silicone in contact with the master wasdegassed by exposing to a vacuum, and then cured for 2 hours at 70° C.After peeling from the master tool, a PDMS stamp was provided with arelief pattern comprising raised features approximately 1.8 micrometersin height. For both hex mesh and square mesh stamps, the raised featureswere the lines defining the respective mesh geometry, as describedabove.

Inking

The stamp was inked by contacting its back side (flat surface withoutrelief pattern) to a solution of octadecylthiol (“ODT” 00005, TCIAMERICA, Wellesley Hills, Mass.) in ethanol for 20 hours. 10 mM of ODTsolution was used for the stamp with square mesh pattern, and 5 mM ofODT solution was used for the stamp with hex mesh pattern.

Stamping

Metalized polymer film substrates were stamped with inked stamps asdescribed above. For stamping, the metalized film was contacted to thestamp relief patterned-surface, which was face up, by first contactingan edge of the film sample to the stamp surface and then rolling thefilm into contact across the stamp, using a foam roller with diameter ofapproximately 3.0 centimeters. The rolling step required less than 1second to execute. After rolling step, the substrate was contacted withthe stamp for 10 seconds. Then, the substrate was peeled from the stamp,a step that required less than 1 second.

Etching

After stamping, the metallized film substrate with printed pattern wasimmersed into an etchant solution for selective etching and metalpatterning. For printed metalized film substrates bearing a gold thinfilm, the etchant comprised 1 gram of thiourea (T8656, Sigma-Aldrich,St. Louis, Mo.), 0.54 milliliter of concentrated hydrochloric acid(HX0603-75, EMD Chemicals, Gibbstown, N.J.), 0.5 milliliter of hydrogenperoxide (30%, 5240-05, Mallinckrodt Baker, Phillipsburg, N.J.), and 21grams of deionized water. To pattern the gold thin film, the printedmetalized film substrate was immersed in the etch solution for 50seconds. For printed metalized film substrates bearing a silver thinfilm, the etchant comprised 0.45 grams of thiourea (T8656,Sigma-Aldrich, St. Louis, Mo.), 1.64 grams of ferric nitrate (216828,Sigma-Aldrich, St. Louis, Mo.), and 200 milliliter of deionized water.To pattern the silver thin film, the printed metalized film substratewas immersed in the etch solution for 3 minutes. After patterned etchingof the gold, residual chromium was etched using a solution of 2.5 gramsof potassium permanganate (PX1551-1, EMD Chemicals, Gibbstown, N.J.), 4grams of potassium hydroxide (484016, Sigma-Aldrich, St. Louis, Mo.),and 100 milliliters of deionized water.

Characterization

After selective etching and metal patterning, the metal patterns werecharacterized using an optical microscope (Model ECLIPSE LV100D equippedwith a DS-Fil digital camera and NIS-Elements D software, Nikon,Melville, N.Y.), scanning electron microscope (SEM, Model JSM-6400, JEOLLtd, Tokyo, Japan), and Haze-Gard (Haze-Gard plus, BYK Gardner,Columbia, Md.). The microscopic techniques were used to determine thewidth of line features in the metal pattern. Haze-Gard was used todetermine the transmission and the haze for the mesh-grid coated films.The Haze-Gard measurements were done after laminating the patterned filmon a glass with an optical clear adhesive (3M Product). The visibilityfactor of high, medium, and low was assigned to describe the degree ofvisibility of line features in the metal pattern (human observation withunaided eye).

Example 6

A hexagonal mesh grid pattern of thin film gold was fabricated andcharacterized according to the procedures described above. The inksolution comprised octadecylthiol dissolved in ethanol at aconcentration of 5 mM. The ink solution was contacted to the back sideof the stamp for 20 hours. The stamping time was 10 seconds. FIG. 1gives an SEM photomicrograph recorded from the completed thin film goldmicropattern. The actual line width measured approximately 1.63micrometers. The percentage of open area was recalculated based on themeasured line width and the designed edge-to-edge width of 400micrometers, which is 99.2%. The optical properties of the gold Hex meshgrid coated film were determined by Haze-Gard. The haze and thetransmission measured approximately 1.14% and 91.6%, respectively. Highvisibility was assigned to this example because the gold Hex meshpattern with a line width of 1.63 micrometers and an edge-to-edge widthof 400 micrometers can be easily seen.

Examples 7 to 15

Hexagonal mesh grid patterns of thin film gold were fabricated andcharacterized according to the procedures described in Example 1. Theactual line width for each example was measured using SEM and listed inTable 1. The percentage of open area was then recalculated based on theactual line width and designed edge-to-edge width and listed in Table 1.Table 1 also gives the haze value and the transmission value for eachexample measured by Haze-Gard and the visibility factors assigned toeach example.

Example 16

A square mesh grid pattern of thin film gold was fabricated andcharacterized according to the procedures described above. The inksolution comprised octadecylthiol dissolved in ethanol at aconcentration of 10 mM. The ink solution was contacted to the back sideof the stamp for 20 hours. The stamping time was 10 seconds. The actualline width measured approximately 4.73 micrometers using opticalmicroscope. The percentage of open area was recalculated based on themeasured line width and the designed pitch of 320 micrometers, which is97.0%. The optical properties of the gold Square mesh grid coated filmwere determined by Haze-Gard. The haze and the transmission measuredapproximately 1.58% and 88.6%, respectively. High visibility wasassigned to this example because the gold Square mesh pattern with aline width of 4.73 micrometers and a pitch of 320 micrometers can beeasily seen.

Examples 17-23

Square mesh grid patterns of thin film gold were fabricated andcharacterized according to the procedures described in Example 11. Theactual line width for each example was measured using optical microscopeand listed in Table 1. The percentage of open area was then recalculatedbased on the actual line width and designed pitch and listed in Table 1.Table 1 also gives the haze value and the transmission value for eachexample measured by Haze-Gard and the visibility factors assigned toeach example.

Example 24

A hex mesh grid pattern of thin film silver was fabricated andcharacterized according to the procedures described above. Thesilver-coated substrates were prepared by sputtering. The ink solutioncomprised octadecylthiol dissolved in ethanol at a concentration of 5mM. The ink solution was contacted to the back side of the stamp for 20hours. The stamping time was 10 seconds. FIG. 2 gives an SEMphotomicrograph recorded from the completed thin film silvermicropattern. The actual line width measured approximately 2.43micrometers. The percentage of open area was recalculated based on themeasured line width and the designed edge-to-edge width of 600micrometers, which is 99.2%. The optical properties of the gold Hex meshgrid coated film were determined by Haze-Gard. The haze and thetransmission measured approximately 1.19% and 91.8%, respectively. Highvisibility was assigned to this example because the silver Hex meshpattern with a line width of 2.43 micrometers and an edge-to-edge widthof 600 micrometers can be easily seen.

Examples 25 to 32

Hex mesh grid patterns of thin film silver were fabricated andcharacterized according to the procedures described in Example 19. Theactual line width for each example was measured using SEM and listed inTable 1. The percentage of open area was then recalculated based on theactual line width and designed edge-to-edge width and listed in Table 1.Table 1 also gives the haze value and the transmission value for eachexample measured by Haze-Gard and the visibility factors assigned toeach example.

Example 33

A Square mesh grid pattern of thin film silver was fabricated andcharacterized according to the procedures described above. Thesilver-coated substrates were prepared by thermal evaporation. The inksolution comprised octadecylthiol dissolved in ethanol at aconcentration of 10 mM. The ink solution was contacted to the back sideof the stamp for 20 hours. The stamping time was 10 seconds. The actualline width measured approximately 5.9 micrometers using opticalmicroscope. The percentage of open area was recalculated based on themeasured line width and the designed pitch of 320 micrometers, which is96.3%. The optical properties of the silver Square mesh grid coated filmwere determined by Haze-Gard. The haze and the transmission measuredapproximately 1.77% and 88.9%, respectively. High visibility wasassigned to this example because the silver Square mesh pattern with aline width of 5.9 micrometers and a pitch of 320 micrometers can beeasily seen.

Examples 34-40

Square mesh grid patterns of thin film silver were fabricated andcharacterized according to the procedures described in Example 28. Theactual line width for each example was measured using optical microscopeand listed in Table 1. The percentage of open area was then recalculatedbased on the actual line width and designed pitch and listed in Table 1.Table 1 also gives the haze value and the transmission value for eachexample measured by Haze-Gard and the visibility factors assigned toeach example.

TABLE 1 Open Line area Example Metal Mesh width fraction HazeTransmission Visibility number type geometry (μm) (%) (%) (%) of LinesRegion¹ 6 Gold Hex 1.63 99.2 1.14 91.6 High 2 7 Gold Hex 2.92 99.0 1.0491.6 High 2 8 Gold Hex 2.91 99.0 1.2 91.5 High 2 9 Gold Hex 1.92 98.71.37 91.4 Medium 1 10 Gold Hex 2.14 97.9 1.61 91.2 Low 1 11 Gold Hex1.84 98.2 1.62 90.9 Low 1 12 Gold Hex 2.65 98.2 1.42 90.8 Medium 1 13Gold Hex 2.69 97.3 1.76 90.6 Low 1 14 Gold Hex 1.13 97.7 2.57 90.3 Low 215 Gold Hex 2.27 97.7 1.78 90.3 Low 1 16 Gold Square 4.73 97.0 1.58 88.6High 2 17 Gold Square 3.01 96.2 2.33 88.4 Medium 2 18 Gold Square 4.794.1 1.95 86.0 Medium 2 19 Gold Square 3.01 92.5 3.77 85.6 Low 2 20 GoldSquare 4.49 91.4 2.77 83.3 Low 2 21 Gold Square 3.18 87.3 5.45 81.1 Low3 22 Gold Square 4.73 88.2 3.11 80.9 Low 3 23 Gold Square 2.82 86.9 6.6879.1 Low 3 24 Silver Hex 2.43 99.2 1.19 91.8 High 2 25 Silver Hex 2.1899.3 1.45 91.7 High 2 26 Silver Hex 1.92 99.0 1.39 91.5 High 2 27 SilverHex 2.44 98.4 1.62 91.3 Medium 1 28 Silver Hex 0.94 99.1 1.92 91.2 Low 129 Silver Hex 2.18 98.6 1.92 91.0 Medium 1 30 Silver Hex 2.55 97.5 1.9390.8 Low 1 31 Silver Hex 1.81 98.2 1.96 90.7 Low 1 32 Silver Hex 2.8997.1 2.04 90.0 Low 1 33 Silver Square 5.9 96.3 1.77 88.9 High 3 34Silver Square 3.35 95.8 2.46 88.0 Medium 2 35 Silver Square 5.57 93.12.55 86.2 Medium 3 36 Silver Square 2.76 93.1 3.99 85.0 Low 2 37 SilverSquare 5.74 89.1 3.49 83.6 Low 3 38 Silver Square 5.7 85.8 4.09 80.8 Low3 39 Silver Square 2.98 88.1 5.69 80.2 Low 3 40 Silver Square 2.78 87.17.0 77.6 Low 3 ¹Region refers to the different regions as shown andlabeled in FIG. 24.

Example 41

A transparent sensor element was fabricated and combined with a touchsensor drive device as generally shown in FIGS. 27, 28 and 29 usingmicrocontact printing and etching as described in co-assigned U.S.Provisional application 61/032,273. The device was then integrated witha computer processing unit connected to a display to test the device.The device was able to detect the positions of multiple single and orsimultaneous finger touches, which was evidenced graphically on thedisplay. This example used micro-contact printing and etching techniques(see also co-pending U.S. Patent App. No. 61/032,273) to form themicro-conductor pattern used in the touch sensor.

Formation of a Transparent Sensor Element

First Patterned Substrate

A first visible light substrate made of polyethylene terephthalate (PET)having a thickness of 125 micrometers (μm) was vapor coated with 100 nmsilver thin film using a thermal evaporative coater to yield a firstsilver metalized film. The PET was commercially available as productnumber ST504 from E.I. du Pont de Nemours, Wilmington, Del. The silverwas commercially available from Cerac Inc., Milwaukee, Wis. as 99.99%pure 3 mm shot.

A first poly(dimethylsiloxane) stamp, referred to as PDMS andcommercially available as product number Sylgard 184, Dow Chemical Co.,Midland, Mich., having a thickness of 3 mm, was molded against a 10 cmdiameter silicon wafer (sometimes referred to in the industry as a“master”) that had previously been patterned using standardphotolithography techniques. The PDMS was cured on the silicon wafer at65° C. for 2 hours. Thereafter, the PDMS was peeled away from the waferto yield a first stamp having two different low-density regions withpatterns of raised features, a first continuous hexagonal mesh patternand a second discontinuous hexagonal mesh pattern. That is, the raisedfeatures define the edges of edge-sharing hexagons. A discontinuoushexagon is one that contains selective breaks in a line segment. Theselective breaks had a length less than 10 μm. The breaks were designedand estimated to be approximately 5 μm. In order to reduce theirvisibility, it found that, preferably, the breaks should be less than 10μm, more preferably, 5 μm or less, e.g., between 1 and 5 μm. Each raisedhexagon outline pattern had a height of 2 μm, had 1% to 3% areacoverage, corresponding to 97% to 99% open area, and line segments thatmeasured from 2 to 3 μm in width. The first stamp also included raisedfeatures defining 500 μm wide traces. The first stamp has a firststructured side that has the hexagonal mesh pattern regions and thetraces and an opposing second substantially flat side.

The stamp was placed, structured side up, in a glass Petri dishcontaining 2 mm diameter glass beads. Thus, the second, substantiallyflat side was in direct contact with the glass beads. The beads servedto lift the stamp away from the base of the dish, allowing the followingink solution to contact essentially all of the flat side of the stamp. A10 millimolar ink solution of 1-octadecanethiol (product number C18H3CS,97%, commercially available from TCI America, Portland Oreg.) in ethanolwas pipetted into the Petri dish beneath the stamp. The ink solution wasin direct contact with the second substantially flat side of the stamp.After sufficient inking time (e.g., 3 hours) where the ink has diffusedinto the stamp, the first stamp was removed from the petri dish. Theinked stamp was placed, structured side up, onto a working surface. Thefirst silver metalized film was applied using a hand-held roller ontothe now inked structured surface of the stamp such that the silver filmwas in direct contact with the structured surface. The metalized filmremained on the inked stamp for 15 seconds. Then the first metalizedfilm was removed from the inked stamp. The removed film was placed forthree minutes into a silver etchant solution, which contained (i) 0.030molar thiourea (product number T8656, Sigma-Aldrich, St. Louis, Mo.) and(ii) 0.020 molar ferric nitrate (product number 216828, Sigma-Aldrich)in deionized water. After the etching step, the resulting firstsubstrate was rinsed with deionized water and dried with nitrogen gas toyield a first patterned surface. Where the inked stamp made contact withthe silver of the first metalized substrate, the silver remained afteretching. Thus silver was removed from the locations where contact wasnot made between the inked stamp and silver film.

FIGS. 27, 27 a and 27 b show a first patterned substrate 700 having aplurality of first continuous regions 702 alternating between aplurality of first discontinuous regions 704 on a first side of thesubstrate, which is the side that contained the now etched and patternedsilver metalized film. The substrate has an opposing second side that issubstantially bare PET film. Each of the first regions 702 has acorresponding 500 um wide conductive trace 706 disposed at one end. FIG.27 a shows an exploded view of the first region 702 having a pluralityof continuous lines forming a hexagonal mesh structure. FIG. 27 b showsan exploded view of the first discontinuous region 704 having aplurality of discontinuous lines (shown as selective breaks in eachhexagon) forming a discontinuous hexagonal mesh structure. Each meshstructure of regions 702 and 704 had 97% to 99% open area. Each linesegment measured from 2 to 3 μm.

Second Patterned Substrate

The second patterned substrate was made as the first patterned substrateusing a second visible light substrate to produce a second silvermetalized film. A second stamp was produced having a second continuoushexagonal mesh pattern interposed between a second discontinuoushexagonal mesh pattern.

FIGS. 28, 28 a and 28 b show a second patterned substrate 720 having aplurality of second continuous regions 722 alternating between aplurality of second discontinuous regions 724 on a first side of thesecond substrate. Each of the second regions 722 has a corresponding 500um wide second conductive trace 726 disposed at one end. FIG. 28 a showsan exploded view of one second region 722 having a plurality ofcontinuous lines forming a hexagonal mesh structure. FIG. 28 b shows anexploded view of one second discontinuous region 724 having a pluralityof discontinuous lines (shown as selective breaks in each hexagon)forming discontinuous hexagonal mesh structure. The selective breaks hada length less than 10 μm. The breaks were designed and estimated to beapproximately 5 μm. In order to reduce their visibility, it found that,preferably, the breaks should be less than 10 μm, more preferably, 5 μmor less, e.g., between 1 and 5 μm. Each mesh structure of region 722 and724 had 97% to 99% open area. Each line segment measured from 2 to 3 μm.

Formation of a Projected Capacitive Touch Screen Sensor Element

The first and second patterned substrates made above were used toproduce a two-layer projected capacitive touch screen transparent sensorelement as follows.

The first and second patterned substrates were adhered together usingOptically Clear Laminating Adhesive 8141 from 3M Company, St. Paul,Minn. to yield a multilayer construction. A handheld roller was used tolaminate the two patterned substrates with the regions of the first andsecond conductive trace regions 706 and 726 being adhesive free. Themultilayer construction was laminated to a 0.7 mm thick float glassusing Optically Clear Laminating Adhesive 8141 such that the first sideof the first substrate was proximate to the float glass. The adhesivefree first and second conductive trace regions 706 and 726 allowedelectrical connection to be made to the first and second patternedsubstrates 700 and 720.

The integrated circuits used to make mutual capacitance measurements ofthe transparent sensor element were PIC18F87J10 (Microchip Technology,Chandler, Ariz.), AD7142 (Analog Devices, Norwood, Mass.), andMM74HC154WM (Fairchild Semiconductor, South Portland, Me.). ThePIC18F87J10 was the microcontroller for the system. It controlled theselection of sensor bars which MM74HC154WM drives. It also configuredthe AD7142 to make the appropriate measurements. Use of the systemincluded setting a number of calibration values, as is known in the art.These calibration values can vary from touch screen to touch screen. Thesystem could drive 16 different bars and the AD7142 can measure 12different bars. The configuration of the AD7142 included selection ofthe number of channels to convert, how accurately or quickly to takemeasurements, if an offset in capacitance should be applied, and theconnections for the analog to digital converter. The measurement fromthe AD7142 was a 16 bit value representing the capacitance of the crosspoint between conductive bars in the matrix of the transparent sensorelement.

After the AD7142 completed its measurements it signaled themicrocontroller, via an interrupt, to tell it to collect the data. Themicrocontroller then collected the data over the SPI port. After thedata was received, the microcontroller incremented the MM74HC154WM tothe next drive line and cleared the interrupt in the AD7142 signaling itto take the next set of data. While the sampling from above wasconstantly running, the microcontroller was also sending the data to acomputer with monitor via a serial interface. This serial interfaceallowed a simple computer program, as are known to those of skill in theart, to render the raw data from the AD7142 and see how the values werechanging between a touch and no touch. The computer program rendereddifferent color across the display, depending on the value of the 16 bitvalue. When the 16 bit value was below a certain value, based on thecalibration, the display region was rendered white. Above thatthreshold, based on the calibration, the display region was renderedgreen. The data were sent asynchronously in the format of a 4 byteheader (0xAAAAAAAA), one byte channel (0x00-0x0F), 24 bytes of data(represents the capacitive measurements), and carriage return (0x0D).

Results of Testing of the System

The transparent sensor element was connected to the touch sensor drivedevice. When a finger touch was made to the glass surface, the computermonitor rendered the position of touch that was occurring within thetouch sensing region in the form of a color change (white to green) inthe corresponding location of the monitor. When two finger touches weremade simultaneously to the glass surface, the computer monitor renderedthe positions of touches that were occurring within the touch sensingregion in the form of a color change (white to green) in thecorresponding locations of the monitor. When three finger touches weremade simultaneously to the glass surface, the computer monitor renderedthe positions of touches that were occurring within the touch sensingregion in the form of a color change (white to green) in thecorresponding locations of the monitor.

Example 42

One embodiment of microreplicated electrodes comprises parallelconductors with a width of about 0.5 to about 5 microns (Y dimension inFIG. 5), separated by a distance of about 2 mm to about 5 mm center tocenter. Groups of adjacent conductors may be electrically interconnectedto form electrodes of 1 mm to 10 mm total width, for example, using theprocess described with respect to FIG. 8 and FIG. 9.

The traces were made by forming rectangular microreplicated grooves 10um wide (X dimension in FIG. 5), 20 um deep (Z dimension in FIG. 5),spaced 4 mm apart on a transparent substrate of PET using methodsdescribed herein and by reference. The parallel array of grooves was 100mm wide. Grooves were printed in the PET web direction so their lengthwas the length of the web, (>20 meters).

Grooves were filled with a seed ink manufactured by Conductive InkjetTechnologies, (CIT). A thin layer of ink was smoothed over the groovesthen excess was removed with a doctor blade in a process similar to silkscreening. The seed ink was then cured using UV light. The substratewith ink-filled grooves was then electroless plated with copper. Theresulting microconductors were each approximately 9.6 um wide. The inkfilling, UV curing, and electroless plating process was performed byCIT. Microconductors with substrates with grooves <10 um wide, 20 umdeep, spaced 2 mm were also made using the process described.

Electrode Designs that Utilize Micro-Wire Conductors

Turning now to FIGS. 29-36, a number of different micro-wire electrodeembodiments are described. The micro-wire printing techniques describedabove afford a great deal of design flexibility to individual electrodepatterns. Such design flexibility can enhance performancecharacteristics. For example, as further described in U.S. PatentApplication Publication No. US2010/0026,664, “Touch Sensitive Deviceswith Composite Electrodes”, it is possible to tailor electrode design toimprove a feature referred to as perviousness—that is, the tendency toallow passage of an electric field through an electrode, to capacitivelycouple with a pointing object, such as a finger. In some arrangements,an upper electrode that is pervious may better allow capacitive couplingbetween a pointing object (i.e., a finger) and a lower electrodepositioned where the upper and lower electrodes cross over one another.This may allow for better signal-to-noise performance of the electrode.However, holes or gaps in an electrode may make them more visuallynoticeable to a user, which is generally not desirable. Embodimentsshown below generally are structured on a reference mesh, and includeareas of continuous and discontinuous micro-wire conductors, which mayresult in both improved electrical performance and consistent visualcharacteristics that render electrode patterning less noticeable.

FIG. 29 illustrates a portion of a sensor electrode according to a firstembodiment of the present invention. The sensor electrode pattern ofFIG. 29 could be employed, for instance, in place of the electrodesillustrated in FIG. 28. The sensor electrode of FIG. 29 is built fromtwo coincident micropatterns of cells 810, including a first patterncomprised of a first reference mesh of discontinuous micro-wires withfirst characteristic average cell spacing (810 a), and a second patternadapted from the network of the first pattern, where the second patternis coincident with the first pattern, and comprises a network ofcontinuous micro-wire structures that form a single electrode 817 (810b). The electrode includes interior regions 815 of discontinuousmicro-wires that follow a third pattern, which may be the same orsimilar to the first pattern or the second pattern. (In this FIG. 29,the first and second and third patterns are the same pattern modeledafter the first lattice mesh—repeating squares 45 degrees off axis—butin other embodiments, the first, second, and third patterns may be thesame or may be different). Interior regions 815 have dimensionssubstantially larger than the first characteristic average cell spacing.

The selection of the first, second, and third patterns, is designed toestablish a uniform optical property throughout the active area of thesensing device. In one embodiment, the first second and third patternsare all based on the same pattern, that is, the first lattice mesh, asis seen in FIG. 29. The average cell spacing, along with the width ofthe patterned micro-wires that form the mesh, determines an average openarea of the underlying mesh and an optical density which primarilyaffects overall sensor properties such as optical transmittance andreflectance. Whether particular local regions of the underlying mesh areconductive (second pattern) or not (first and third patterns) isdetermined by the patterning of small (and nearly invisible) breaksalong the length of the micro-wires. The first pattern, that is, theunderlying lattice mesh of FIG. 29, is built from an array of simplesquares whose axes are oriented 45 degrees to the printed page. It willbe understood that alternative designs may comprise the lattice meshpatterns seen in FIG. 29, including without limitation lattice meshpatterns using triangles, pyramids, trapezoids, parallelograms,hexagons, or other repeating shapes. In some embodiments the cells whichmake of the array may be polygons with straight sides; in otherembodiments the boundaries of the arrayed cells may be curved, convex,or concave. The plurality of cells which make up the array need not beequal in area, although for purposes of optical density, the localaverage cell spacing is preferably kept uniform throughout the sensingdevice. In alternative embodiments the principle axes of any of thearrays may be disposed along any arbitrary angle. In some embodimentsthe first pattern lattice mesh need not be comprised of a regularrepeating array of cells, but may be built instead from a random networkof metal micro-wires, without any discernable principle axes. It may bepreferable that the pseudo-random network of metal wires is stillcharacterized by a local average cell spacing which can establish auniform optical property. Even a random network of metal micro-wires canbe rendered locally conductive or non-conductive by the patterning ofthe appropriate number of small breaks along the lengths of the wires.

Each of the three patterns is characterized by an average cell spacing.The characteristic cell spacing can vary between 10 microns and 1millimeter, however for reasons of optical transmittance and patternvisibility the cell spacing in one embodiment is preferably in the rangebetween 100 and 350 microns. The micro-wire conductors can be patternedwith widths between 0.2 microns and 10 microns. In one embodiment, themicro-wire widths are less than 3 microns and preferably less than 2microns.

The second pattern illustrated in FIG. 29, the electrically continuouspattern which comprises electrode 817, is in one embodiment coincidentto the mesh of the first pattern. The design of the second patternestablishes the electrical function and circuitry of the electrodes forthe touch sensor. The second pattern in FIG. 29 is designed as acontinuously conductive electrode oriented vertically, which functionsas one of a plurality of upper column electrodes in a sensor electrodearray. The pattern shown in FIG. 29 is one of an upper electrode array,but could also be one of a lower electrode array. In alternativeembodiments, a second pattern similar to the second pattern of FIG. 29can form an electrode directed along any arbitrary angle.

The sensor electrode established by the second pattern of FIG. 29includes interior regions 815 according to the third pattern. Theinterior regions comprise a mesh of discontinuous, or broken,micro-wires, in some embodiments quite similar to or the same as thefirst pattern. The interior region in one embodiment includes dimensionsgreater than 350 microns across in any direction. Within interior regionformed by the third pattern, the underlying mesh of the first patternincludes breaks along the micro-wires to render the mesh within the gapnon-conductive. The interior region is patterned in one embodiment to becoincident with the first pattern.

The interior regions 815 shown in second pattern of FIG. 29 representjust two of many more interior regions which can be arranged along thelength of the sensor electrode 817. For instance one or more of theseinterior regions may be placed centered over cross-over pointsassociated with lower electrodes, the interior regions having the samepitch as the lower electrode spacing. The presence of a non-conductiveinterior region or hole within the column electrode of FIG. 29 increasesthe capacitive difference signal detected by the sensor when a finger orany grounded object is placed near the intersection of one of the rowand column electrodes. The presence of the interior region increases theperviousness of the column electrode to electric fields which emanatefrom the underlying row electrodes. In one embodiment, the interiorregion in the second pattern of the column electrode spans a distanceequal to at least two mesh cells of the first or the second patterns. Ina further embodiment, the interior region in the electrode defined bythe third pattern should be at least twice as large as the average cellspacing (or mesh size) of the first pattern or the second pattern in anypattern direction. Commonly, an interior region without any patternedmicropattern (that is, a bare hole) within a column electrode as largeas 350 microns across would be big enough to be noticeable to the humaneye. However, in FIG. 29 the interior region is filled with acontinuation of the mesh of the first or second pattern (which asmentioned in the embodiment shown in FIG. 29 are the same), to achieve auniform optical density which renders the interior region virtuallyinvisible to the human eye. In other words, the first pattern may bethought to establish a reference mesh, and the second and third patternsare coincident to this reference mesh. In this fashion interior regionsin the electrodes as large as 1 to 5 mm across can be designed into thesensor electrodes with reduced risk of pattern visibility.

The width “A” of the sensor electrode established by the second patternof FIG. 29 in some embodiments can be in the range of 200 microns to 10millimeters.

FIG. 30 a, illustrates a portion of a sensor electrode according to asecond embodiment. The sensor electrode pattern of FIG. 30 a could beemployed in place of the vertical electrodes illustrated in FIG. 28. Thesensor electrode of FIG. 30 a is built from coincident micropatterns,including a first pattern comprised of a first mesh with firstcharacteristic average cell spacing, and a second pattern adapted fromthe network of the first pattern, where the second pattern comprises aconductive electrode 817B, and a third pattern that comprises interiorregions 815B in the electrode 817B, the interior regions having interiordimensions substantially larger than the first characteristic averagecell spacing. The first micropattern illustrated in FIG. 30 a is thesame as the underlying mesh pattern employed in FIG. 29. Any of thealternative mesh patterns described with respect to FIG. 29 can beusefully substituted, including regular hexagonal mesh patterns orrandom networks of metal micro-wires.

The second pattern in FIG. 30 a, which establishes the functionalgeometry of an upper sensor electrode, is built by rendering conductivea continuous chain of underlying mesh cells to create an electrode whichis locally only as wide as a single average cell from the first pattern.The complete sensor electrode in FIG. 30 a, however, consists of anintertwined ladder or trellis structure of conductive chains which areall built from the cells of the underlying first pattern. In between therungs of the ladder or between the vines of the trellis of the secondpattern, the underlying mesh of the first pattern is renderednon-conductive by means of small breaks in the micro-wires, to forminterior regions 815B. In the embodiment shown in FIG. 30 a, the thirdpattern that comprises the interior regions is the same as the first andsecond patterns. In other embodiments, they may be different. In theparticular example of FIG. 30 a, the conductive cells of the secondpattern are laid-out as a connected array or super-structure of largerdiamonds, the pattern extending continuously along the vertical axis ofthe figure. The distance between conductive chains on opposite sides ofthe diamond is exactly 7 cells from the underlying mesh structure. In asimilar fashion to FIG. 29, therefore, the electrode pattern of FIG. 30includes a series of non-conductive interior regions by the conductivetraces of the second pattern. These large non-conductive regionsincrease the perviousness of the sensor electrode illustrated in FIG. 30a; the gaps increase the capacitive difference signal detected by thesensor when a grounded object (such as a finger) is placed near theintersection of a row and column electrodes.

The width of the sensor electrode at its widest point established by thesecond pattern of FIG. 30 a in one embodiment is in the range of 200microns to 10 millimeters.

In FIG. 30 a the conductive traces which are used to build the largerdiamond super-structure are only as wide as a single cell from theunderlying mesh structure, or reference mesh. In alternative embodimentsthe conductive traces could be as wide as 2, 3, 4 or more cells inwidth. Additionally, the conductive traces of the super-structure neednot be uniform in width along their length. The conductive chains of asecond pattern similar to FIG. 30 a might be comprised of sections whosewidth incorporates alternately 1, 2, or 3 cells from the underlyingmesh. In an alternate embodiment, if the first micropattern is builtfrom a random network of metal micro-wires, then the width of theconductive sections in the superstructure might be characterized by anyaverage fractional number larger than the characteristic average cellspacing. For instance the effective width of a conductive trace might be1.1 times the average cell spacing, or 1.6 times, or 2.3 times theaverage cell spacing.

In FIG. 30 a, the micro-wires that form the mesh lattice within theconductive traces of the second pattern super-structure are shown asbroken traces. The conductive traces, therefore, have an anisotropicconductive aspect wherein the conductivity in a direction orthogonal tothe direction of the conductive traces in the second pattern is very lowcompared to the conductivity along the length of the conductive trace.In an alternative embodiment, however, all of the micro-wires within theconductive traces can be patterned without breaks, so that theconductivity of the second pattern is maximized and anisotropic.

Turning now to FIG. 30 b, an electrode configuration similar to thatshown with respect to FIG. 30 a is shown, but in this case additionallyincluding island 819 which is electrically isolated from electrode 817b, and within the electrically discontinuous interior region 815 b.Island 819 is formed of electrically continuous micro-wires accordingto, and coincident with, the underlying mesh pattern that in thisembodiment forms pattern 1, pattern 2, and pattern 3. FIG. 30 c shows afurther embodiment of a possible electrode configuration.

FIG. 31 a illustrates a further embodiment of an electrode. The sensorelectrode of FIG. 31 a is built from coincident micropatterns, includinga first pattern comprised of a first mesh with first characteristicaverage cell spacing, and a second pattern adapted from the network ofthe first pattern, where the second pattern comprises a conductiveelectrode 817C, and a third pattern that comprises interior regions 815Cin the electrode 817C, the interior regions having interior dimensionssubstantially larger than the first characteristic average cell spacing.The first micropattern illustrated in FIG. 31 a utilizes the sameunderlying mesh pattern as shown with respect to FIG. 29. Any of thealternative mesh patterns described with respect to FIG. 29 can beusefully substituted, including regular hexagonal mesh patterns orrandom networks of metal micro-wires. The second pattern of FIG. 31 a,which establishes the functional form of the conductive electrode,comprises electrically continuous, or unbroken, conductive cells fromthe underlying mesh. The conductive traces of the second pattern in FIG.31 a that form electrode 817C are laid-out as a trellis-type structure.In some parts of the trellis structure the conductive traces are thewidth of 2 cells from the underlying mesh structure, or reference mesh,in other parts of the trellis the conductive traces are only 1 cellwide. The interior regions formed between the conductive traces are 4cells wide in the horizontal direction and 9 cells tall in the verticaldirection. The optical density of the underlying first pattern is keptconstant at all positions throughout the sensor, and as a result theparticular geometry of the trellis (the conductive super-structure) inFIG. 31 a will be virtually unnoticeable to the human eye.

The width of the sensor electrode 817C established by the second patternof FIG. 31 a in some embodiments are in the range of 200 microns to 10millimeters.

FIG. 31 b shows a variation on the electrode configuration shown withrespect to FIG. 31 a. Electrode 817 cc includes branching elements 818electrically connected to electrode 817 cc, extending outward therefrom.In the embodiment shown with respect to FIG. 31 a, the branchingelements extend into the interior regions. The branching elements arecoincident with the third pattern (which is the pattern associated withthe interior region). The pattern of the branching elements is alsocoincident with the reference mesh of the first pattern. The branchingelements are comprised of continuous micro-wires.

The distance between any two branching elements is equal to or greaterthan the average characteristic cell spacing of the underlying mesh. Thebranching elements 818 shown with respect to electrode 817 cc areseparated by a distance equal to two characteristic cell spacings withinthe third-pattern mesh of the interior region 815 c. In alternateembodiments a greater or lesser density of branching elements can beprovided within interior regions, by increasing or decreasing theseparation between branching elements, generally by integer multiples ofthe underlying reference spacing. In this fashion the quality ofperviousness to electric fields associated with these interior regionscan be tuned to fit a particular application.

Continuous micro-wire conductors used in electrode 817 cc have acharacteristic average width, and the width of the branching elements isthe same; i.e., the branching elements may have the geometry of theelectrically continuous micro-wire conductors that comprise the trunkportion of electrode 817 cc.

FIG. 31 c shows yet a further variation on the electrode configurationshown with respect to FIGS. 31 a and 31 b. Electrode 817 ccc does notinclude interior regions shown with respect to FIGS. 31 a and 31 b.Electrode 817 ccc has a main electrode trunk 819, and extending outwardfrom the trunk are branching elements 818, each formed of continuousmicro-wires coincident with the underlying reference mesh. The branchingelements extend outward into the surrounding area of the first pattern,which comprises electrically discontinuous, or broken, micro-wires alsocoincident with the underlying reference mesh pattern. Each cell of theunderlying reference mesh has characteristic average cell spacing, andthe distance between branching elements is at least one cell. In theembodiment shown, each branching elements couples to the electrode trunkat no more than one terminal area. The main trunk of electrode 817 cccis disposed along a first direction and the branching elements extendoutward along a direction which is substantially transverse to the firstdirection.

The length of the branching elements 818 are greater than thecharacteristic average cell spacing of the reference mesh. In someembodiments the branching elements can be more than 5 times longer thanthe characteristic average cell spacing and in other embodiments thebranching elements can be more than 10 times longer than thecharacteristic average cell spacing. The branching elements 818, whichare attached to the electrode 817 ccc in FIG. 31 c, include a pluralityof different lengths. In some embodiments, the lengths are chosen toconform to a preferred outline or shape for the conductive electrode.For instance, the branching elements of electrode 817 ccc, takentogether, conform to a diamond shape that is centered on the centraltrunk.

The capacitance sensitivity of the electrode 817 ccc, and itsperviousness as a function of position, can be tuned by means ofdesigned variations in the length and in the spacing between branchingelements 818. For instance, the branching elements of electrode 817 cccare spaced apart by one cell spacing of the underlying reference mesh.In an alternate embodiment the branching elements can be spaced apart bydistances of two or three cell spacings.

As illustrated in FIGS. 27 and 28, a touch sensor commonly employs aplurality of electrodes disposed parallel to each other. The capacitivetouch response of the sensor, however, is not always uniform withrespect to a small object which is passed across and in-between theparallel touch electrodes. Branching elements 818, similar to thoseillustrated in FIG. 31 c, can be used to fill the space between parallelelectrodes and smooth out the sensor response. By employing micro-wirebranching elements, which extend outward from and are disposed betweenthe parallel touch electrodes, the sensor response of each electrode canbe improved while adding relatively little to the total backgroundcapacitance. In some embodiments the micro-wire branching elements fromneighboring electrodes can be interleaved or intermingled in the spacesbetween touch electrodes. This intermingling of touch electrodes ensuresthat a touch response can be recorded simultaneously from each of twoneighboring electrodes regardless of the small size of a touch object.Since touch position is often calculated as an interpolation ofcapacitance signals from neighboring electrodes, the ability to providean intermingling of branching elements between parallel electrodesimproves the accuracy of reports from the touch sensor.

FIG. 32 illustrates a further electrode embodiment. The sensor electrodeof FIG. 32 is built from coincident micropatterns, including a firstunderlying reference mesh pattern comprised of cells with acharacteristic average cell spacing, and a second pattern adapted fromthe network of the first pattern, where the second pattern comprises aconductive electrode 817 c, and a third pattern that comprises interiorregions 815 d in the electrode 817 d. The second pattern, as comparedwith the first pattern, has larger characteristic cell spacing. Thesecond pattern includes an array of super-cells, where each of thesuper-cells comprises an integer multiple of cells from the firstpattern (nine first-pattern cells are included in the super-cell forshown in FIG. 32). The characteristic cell spacing of the second patternis an integer multiple (greater than or equal to 2) of the firstcharacteristic cell spacing (the multiple is 3 in FIG. 32). Themicro-wires that define the electrode 817 d are all patterned withoutbreaks and are continuously conductive. The interior regions of theelectrode 817 d are patterned according to the third pattern (which inthis embodiment is the same as the first pattern) and renderednon-conductive by means of breaks along the length of the micro-wires,rendering the interior regions electrically isolated regions.

The sensor electrode 817 d of FIG. 32 is established by an array ofsuper-cells in the second pattern. The second pattern super-cell arrayof FIG. 32 establishes electrode 817 d which is continuously conductivealong the vertical axis and could be employed, for instance, as one ofthe column electrodes illustrated in FIG. 28. The second pattern in FIG.32 has a width which is established by an alternation between two andthree of the super-cells. The effective electrode width in FIG. 32 canbe anywhere in the range of 200 microns to 10 millimeters.

Any of the alternative mesh patterns described with respect to FIG. 29can be implemented in a coincident lattice structure as shown in FIG.32. For instance the second conductive pattern could be comprised ofhexagonal cells which could be 900 microns across while the firstpattern is comprised of hexagonal cells 300 microns across. In anembodiment where the mesh of the first pattern is formed from apseudo-random network of micro-wires, the second pattern can also bedesigned as a random network of micro-wires. In this pseudo-randomembodiment it is possible for the second characteristic cell spacing tobe any distance greater than the first characteristic cell spacing.However, in order to achieve a useful increase in perviousness, it ispreferred that the second characteristic cell spacing be at least twicethe first characteristic cell spacing.

When compared to the simply-connected electrode geometry illustrated inFIGS. 27 and 28, the inclusion of interior regions for the upperelectrode in FIG. 32 (and the corresponding interior regions describedwith respect to other embodiments discussed herein) may present severaladvantages. The perviousness of the electrode structure of FIG. 32 isconsiderably enhanced. For instance, while the underlying mesh in bothelectrodes may be comprised of cells with a characteristic spacing of200 microns (a spacing which determines the pervasive optical density ofthe pattern), the super-structure conductive mesh in FIG. 32 (the secondpattern that forms electrode 17D) can have a much larger characteristiccell spacing of 800, 1000, or 1200 microns. The interior regionsin-between the conductive traces of the second pattern allow for thepenetration of electric fields from the underlying bottom electrode.Proportionally, a larger fraction of the electric field which couplesthe top and bottom electrodes becomes a fringing field which extendsabove the sensor where it can usefully interact with a nearby finger orconductive object. The proportion or usefulness of these fringing fieldsmay depend on the ratio of the spacing in the conductive second patternin FIG. 32 to either a) the thickness of the dielectric that separatesthe upper and lower electrodes; or b) the thickness of the coveringdielectric that separates the upper electrode from a finger placed uponthe sensor. In one embodiment, it may be preferable if the cell spacingof the conductive second pattern be at least ¼ of either or both of thethicknesses defined above, and more preferable if the cell spacing is atleast ½ of either or both of those thicknesses. Since thesuper-structure conductive mesh, in the second pattern of FIG. 32,allows for cell spacing which is greater than 350 microns, and in someembodiments greater than 600 microns, the superstructure mesh allows forpervious sensor designs with covering dielectrics thicker than 1millimeter and in some embodiments thicker than 2 millimeters.

The embodiments described herein, which include patterned interiorregions of the electrode that are electrically isolated from theelectrode, make possible electrode structures where the conductivetraces of the second pattern cover less than 1 percent of the surfacearea of the electrode, and in many cases less than 0.5% of the surfacearea. These small percentages are characteristic of improvedperviousness.

Embodiments described herein may present another advantage for theperformance of projected capacitance sensors. The capacitive differencesignal detected by the sensor in the presence of a finger increases withthe perviousness of the sensor electrode, and at the same time theabsolute capacitive coupling between the finger and the sensor electrodedecreases in comparison to a less pervious electrode. Since noisesignals, which can disrupt the sensing function, tend to scale with thecapacitance between sensor electrode and finger, the pervious nature (orthe small relative surface area covered by the metal traces) of theconductive super-structure in FIG. 32 improves the sensing signal whileat the same time reducing the noise susceptibility of the sensor.

FIG. 33 illustrates a further embodiment. The sensor electrode of FIG.33 is built from coincident micropatterns, including a first patterncomprised of a first mesh with first characteristic average cellspacing, and a second pattern adapted from the network of the firstpattern, where the second pattern comprises a conductive electrode 817e, and a third pattern that comprises interior regions 810 e in theelectrode 817 e, the interior regions having a variety of differentsizes and shapes. The micro-wires that define the electrode 817 e arepatterned without breaks and are continuously conductive. The cells ofthe third pattern which comprise the interior regions of electrode 810 eare rendered electrically isolated from electrode 817 e by means ofbreaks along the length of the micro-wires.

The third pattern, that is, the interior regions 815 e of electrode 817e by contrast to those shown with respect to the electrode configurationshown in FIG. 32, are not uniform. Near the left and right edges of theelectrode shown in FIG. 33, the interior regions are four times largerthan the cells of the underlying mesh pattern (the first pattern). Nearthe center axis of electrode 817 e, the cells of interior regions 815 eare only twice that of the first pattern.

The second pattern, which comprises the conductive electrode, ischaracterized by a cell spacing which is not uniform. The conductiveelectrode illustrated in FIG. 32 was characterized as a super-cell witha fixed and characteristic cell spacing, while by contrast thesuper-structure cell spacing in electrode 817 e varies as a function ofposition. The cell spacing of the continuous mesh located along the leftand right edges of electrode 817 e is larger than the cell spacing foundalong the central axis.

The mesh cells that comprise the conductive second pattern in FIG. 33are generally isotropic, meaning that the cell dimensions are nearlyequal in two orthogonal directions and an integer multiple (greater thanor equal to 2) of the cell dimensions from the underlying mesh.

Any of the alternative mesh patterns described with respect to FIG. 29can be employed in a coincident lattice structure as shown in FIG. 33.For instance the second conductive pattern could be comprised ofhexagonal cells whose dimensions are a multiple of two or greater thanthe dimensions of the hexagonal cells from the first pattern. In anembodiment where the mesh of the first pattern is formed from apseudo-random network of micro-wires, the conductive second pattern andthe electrically isolated interior regions thereof can also be designedas a pseudo-random network of micro-wires. In this pseudo-randomembodiment the average distance between wires in the conductive secondpattern may be at least twice the average characteristic cell spacing ofthe underlying first pattern.

Along the center axis of electrode 817 e in FIG. 33, a conductive trace,or trunk, similar to that of the embodiment shown in FIGS. 31 a, b, andc, has been designed. This conductive trunk is comprised of a chain ofconnected and conductive mesh cells where the central trunk is only aswide as a single cell from the underlying first pattern or referencemesh structure.

In one electrical design of a touch sensor, the capacitive differencesignal of the touch sensor is proportional to the absolute capacitancebetween the finger and the sensor electrode. For an electrode such asthose illustrated in FIGS. 32 and 33, the capacitance between the fingerand sensor electrode will increase with the number and density ofconductive micro-wires in the second pattern. The design of electrode817 e may allow for a variation in capacitance between sensor and object(that is, a finger) as a function of its position along the sensorelectrode. An apparent localized center point of the sensor electrode islocated at the XX position. The density of the second pattern conductivemesh falls off (or the cell spacing increases) as the object moves awayfrom a vertical line through the XX position to either the left or theright, and the density of the second pattern mesh falls off as one movesaway from a horizontal line through the XX position towards either thetop or the bottom of the sensor electrode. The density of thesuperstructure mesh falls off approximately isotropically and radiallyas a finger is moved away from the center point XX. As a result, thesecond pattern conductive mesh of FIG. 33 allows for variation in thecapacitive difference signal as a function of local distance from the XXcenter point of the sensor. This designed variation in sensor responseenables the sensor to detect and interpret finger position with muchbetter accuracy when compared to a sensor that does not include asimilar distribution or variety of interior regions within the electrodestructure.

In the particular embodiment shown with respect to FIG. 33, the cellspacing of the second pattern that comprises electrode 817 e variesdepending on position between 400 and 1000 microns. The density of thesecond pattern conductive mesh and the local capacitance varysignificantly between points on the sensor that are separated by lessthan 1 mm. The structure is also compatible with a pitch betweenneighboring sensor electrodes of 5 to 7 millimeters. Such a structure,with a variation of interior regions, may accommodate position detectionof small fingers and position detection of styli with diameters as smallas 1 mm, even when these objects which are substantially smaller thanthe pitch between sensor electrodes.

It will be understood that FIG. 33, and other similar illustrations ofelectrode designs, illustrates only a portion of a longer sensingelectrode. The overall mesh pattern shown in FIG. 33 can be repeated atintervals along the whole length of a vertical or column electrode,according to the pitch of the electrodes of the other electrode array,where the electrode is one of a plurality of upper column electrodes ina sensor array. The localized center-point XX of the electrode 817 epattern is coincident with the center-point of the intersection of a rowand a column electrode. Since the electrode 817 e pattern repeats alongthe length of each upper electrode, a plurality of localized centerpoints XX will be found at the intersection of each of the row andcolumn electrodes.

The pitch of the sensor electrode center points XX established by thesecond pattern of FIG. 33 can be in the range of 200 microns to 10millimeters. The maximum horizontal width or extent of the upper orcolumn electrode can be any width which is a fraction of the pitch, forinstance the electrode width may vary between 20% of the pitch to 98% ofthe pitch. The width of the intersecting row electrode can be any widthwhich is a fraction of the pitch, for instance the width may varybetween 30% of the pitch to 98% of the pitch. Preferably the width ofthe lower or row electrode would be between 70% and 98% of the pitch.

FIG. 34 illustrates a further embodiment of an electrode configuration.The sensor electrode of FIG. 34 is built from coincident micropatterns,including a first pattern comprised of a first mesh with firstcharacteristic average cell spacing, and a second pattern adapted fromthe network of the first pattern, where the second pattern comprisesconductive electrode 817 f, and a third pattern that comprises interiorregions 815 f in electrode 817 f, the interior regions having a varietyof different sizes and shapes. The micro-wires that define the cells ofthe second pattern are all provided without breaks and are continuouslyconductive. The interior regions 815 f of electrode 817 f are renderedelectrically discontinuous and isolated from electrode 817 f andnon-conductive by means of breaks in the pattern along the length of themicro-wires.

The cell spacings of the second pattern in the electrode shown withrespect to FIG. 34 vary with position along the sensor in a manner whichis similar to the electrode shown with respect to FIG. 33, except thatthe cell-size variations in FIG. 33 are not as isotropic as those shownin FIG. 34. Near the left and right edges of FIG. 34 the cells of theconductive second pattern are 4 times larger than the cells of theunderlying mesh pattern. Near the vertical center line of FIG. 34, thecells of the second pattern are only three times that of the firstpattern. The cells that comprise the superstructure second pattern inFIG. 34 are rectangular. For instance the super-structure cell marked“PP” has a width along the horizontal of four times the cell dimensionof the underlying mesh and a height along the vertical of eight timesthe cell dimension of the underlying mesh.

Any of the alternative mesh patterns described with respect to FIG. 29can be employed in a coincident lattice structure as shown in FIG. 34.An approximately rectangular super-structure cell can still be formed bybounding a collection of underlying hexagonal cells that areapproximately four hexagonal cell widths wide and eight hexagonal cellwidths tall. In an embodiment where the mesh of the first pattern isformed from a pseudo-random network of micro-wires, the conductivesecond pattern can also be designed as a pseudo-random network ofmicro-wires. In this random embodiment the average distance betweenwires in the conductive second pattern do not need to be equal along twoorthogonal directions.

Along the center line of FIG. 34, a conductive trunk in the secondpattern, similar to those employed in the embodiments described earlieris shown. This conductive trunk is comprised of the outlines ofsingle-wide and neighboring mesh cells along the vertical axis. Thelateral micro-wires that comprise the interior regions according to thethird pattern of this central column of conductive cells are maintainedas broken traces.

For the super-structure conductive mesh of FIG. 34 a variation incapacitance has been provided as a function of position along the sensorelectrode. An apparent localized center point of the sensor electrode islocated at the QQ position. The density of the super-structureconductive mesh falls off as a pointing object moves horizontally awayfrom a vertical line through the QQ position to either the left or theright. As the finger moves vertically away from a horizontal linethrough QQ, however, the density of the super-structure mesh changesvery little. The density of the superstructure mesh therefore does nothave an isotropic variation with distance from the center-point QQ.Instead the super-structure shown in the electrode of FIG. 34 isdesigned to present a density variation which has mirror symmetry aboutthe vertical centerline.

FIG. 35 illustrates a further embodiment of an electrode configuration.The sensor electrode of FIG. 35 is built from two coincidentmicropatterns, including a first pattern comprised of a first mesh withfirst characteristic average cell spacing, and a second pattern adaptedfrom the network of the first pattern, where the second patterncomprises a second super-structure mesh with a variety of larger cellspacings. The micro-wires that define the boundaries of the second meshare all patterned without breaks and are continuously conductive. Thecells of the first pattern which lie within the gaps of the secondpattern are rendered non-conductive by means of breaks along the lengthof the micro-wires.

The super-structure of FIG. 35 is similar to that of FIG. 34, exceptthat the overall width or extent of the electrode pattern is FIG. 35 ismore narrow than that shown in FIG. 34, and the variations in cellspacing in the super-structure are much less pronounced. Thesuper-structure cells that comprise the conductive second pattern arerectangular and the density variation presents a mirror symmetry aboutthe vertical trunk or centerline.

If one measures across the width of the sensor electrode in FIG. 35 onewill note that the super-structure pattern is comprised of six verticalconducting lines, while the pattern in FIG. 34 is comprised of eightvertical conducting lines. As a result, the electrode pattern in FIG. 35will have a smaller total capacitance between the upper electrode andthe finger. In some applications this reduced capacitance to the fingercan result in an improved signal-to-noise ratio for the output of thecapacitive sensor. The pattern shown in FIG. 34, however, may present anadvantage to the sensor manufacturer since an electrode with eightvertical lines along each column presents more redundant paths for theflow of current and may thereby be manufactured with a lower probabilityof disabling defects due to broken or in-correctly patterned conductivetraces.

Because of the larger super-structure cell spacings in the conductivemesh of the electrodes shown with respect to FIGS. 34 and 35, however,the total capacitance to the finger in the sensor patterns of FIGS. 34and 35 is considerably less than what would be achieved if the sensorpattern was built from eight vertically-running near-neighbor cells ofthe underlying mesh. As a result, electrodes shown in FIGS. 34 and 35present a greater amount of perviousness and a lower capacitance to thefinger than a simply-connected mesh-based electrode structure withsimilar width.

In a variation of the embodiment shown in FIG. 35, a lateral trellis orextension of conductive cells (the second pattern) can be added whichprotrudes to the left and right from the vertical traces along thehorizontal centerline of each row and column intersection. This lateralextension of the electrode pattern will add somewhat to the totalcapacitance between the upper electrode and the finger, but it can alsoprovide for a variation in the capacitive difference signal as thefinger moves up and down along the length of the sensor electrode. Alateral extension of the conductive cells can therefore improve theaccuracy of position reporting while adding relatively little to theoverall capacitance between the sensor electrode and the finger.

Though embodiments with respect to FIGS. 29-35 have been primarilydescribed in the context of upper electrodes, similar designs andpatterning could be used for lower electrodes. In other words, a lowerelectrode could include interior regions, electrically isolated from thelower electrode, but including patterned microconductors with breaks orbranch elements.

FIG. 36 illustrates a further embodiment of an electrode configuration.The sensor electrode of FIG. 36 is built from coincident micropatterns,including a first pattern comprised of a first mesh with firstcharacteristic average cell spacing, and a second pattern adapted fromthe network of the first pattern, where the second pattern comprises theconductive electrode, and a third pattern that comprises interiorregions 815 b in the electrode, the interior regions having a variety ofdifferent sizes and shapes. The interior regions 815 b of the electrodeare rendered electrically discontinuous and isolated from the electrodeand non-conductive by means of breaks along the length of themicro-wires.

The cell spacings of the second pattern shown with respect to FIG. 36vary with position within the electrode. In contrast to the electrodesof FIGS. 33-35, however, the superstructure cells in the embodimentshown in FIG. 36 are larger in the center of the electrode as comparedto the edge. Near the center of the diamond pattern in FIG. 36 thesuper-structure cells of the conductive second pattern are 3 timeslarger than the cells of the underlying reference mesh. Near the outercorners of the diamond, however, the cell size is smaller.

The electrode shown in FIG. 36 includes interior regions 815 b. The sizeof the interior regions varies as a function of position within theelectrode. The interior regions in the center of the diamond are largerthan those found near the outer edges.

The electrode shown in FIG. 36 allows for a design with capacitancevariations between the sensor and an object (i.e. a finger) as afunction of the object's position along the sensor electrode. Thedensity of the second-pattern conductive mesh in increases (and the cellspacing decreases) as the object moves from the center of the diamondout towards the edges. The density of the superstructure mesh increasesapproximately isotropically and radially as a finger is moved away fromthe center point. This designed variation perviousness or cell spacingmay in some embodiments allow for a more gradual variation in sensorresponse as the finger is moved across the electrode.

Upper and lower electrodes may also be designed such that theirpatterns, at cross-over areas or nodes (where an upper electrode crossesover a lower electrode in, for example, a touch panel), arecomplementary. That is, the active areal conductor trace density of theupper and lower electrode, both comprised of micro-wire patterns formedof individual conductive traces, may have a pattern design and tracedensity such that the areal density of active traces of the upperelectrode varies inversely as compared with the areal density of activetraces in the lower electrode, at the cross-over area.

Active traces are traces that make up the network of continuousmicro-wire structures that form a single electrode. There terms“micro-wires” and “traces” are used interchangeably herein.Discontinuous micro-wire structures do not contribute to the areadensity of active traces. The areal density of active traces (activeareal conductor density) in an area is determined by summing the lengthof active traces and dividing that length (expressed, for example, inmicrometers) by the area (expressed, for example, in squaremicrometers). The units of areal density of active traces are units ofinverse length, for example 1/micrometer, 1/millimeter, or 1/centimeter(also expressed herein as inverse micrometer, inverse millimeter, andinverse centimeter). As an illustrative example, a continuous meshelectrode in the form of a square grid of 1 micrometer wide traces onpitch of 100 micrometers has an areal density of active traces of (200micrometers/(100 micrometers×100 micrometers)=0.02 inversemicrometers=20 inverse millimeters). As further examples, continuousmesh electrodes in the form of square grids of 1 micrometer wide traceson pitches of 50, 100, 150, 200, 250, 300, 350, 400, 450, 500, 1000,2500, 5000, and 10000 micrometers have area densities of active tracesof 40, 20, 13.3, 10, 8, 6.7, 5.7, 5, 4.4, 2, 0.8, 0.4, and 0.2 inversemillimeters, respectively.

Areal density of active traces for continuous micro-wire structures canbe uniform or non-uniform. A non-uniform areal density of active tracesis described herein to be an areal density of active traces that varies(i.e., electrode has variable active areal conductor density). Asunderstood by those of ordinary skill in the art, one must consider thespacing of micro-wire structures in order to target a spatial resolutionover which it is reasonable to determine uniformity or non-uniformity ofareal density. As an unreasonable example at the extremes, even thoughit is understood by those of ordinary skill in the art that a meshelectrode in the form of a square grid of fixed pitch has uniform arealdensity of active traces, one could carry out an areal density analysisat sufficiently high resolution (e.g., analyzing areas much smaller thanthe grid cell size) that such a grid might appear describable asnon-uniform (e.g., with high areal density of active traces along atrace and low areal density of active traces at the center of mesh cellopening). For the purposes of the present disclosure, and specificallyfor describing areal density of active traces or micro-wires, theresolution of areal analysis should be such that an area underconsideration has length dimension in a given direction that is at leastas great as the spacing between traces or micro-wires in that area andin that direction. Such an analysis can lead to determination of a localareal density of active traces. For an electrode having non-uniformareal density of active traces, for example in the electrode overlaparea, there are different positions within the overlap area that havedifferent local areal density of active traces.

Within a cross-over area or node for an upper electrode and a lowerelectrode, the upper electrode has an upper electrode cross-over areaand the lower electrode has a lower electrode cross-over area. Thecross-over areas are limited to those continuous micro-wire portions ofthe upper electrode and those portions of the continuous micro-wirelower electrode that overlap with each other. Continuous micro-wireportions of the upper electrode that overlap with continuous micro-wireportions of the lower electrode are those continuous micro-wire portionsthat superimpose in the x-y plane, with reference of FIG. 2 (e.g., astwo electrode layers would be viewable from the z direction). Continuousmicro-wire portions of the upper electrode that do not overlap withcontinuous micro-wire portions of the lower electrode are not a part ofthe upper electrode cross-over area. Continuous micro-wire portions ofthe lower electrode that do not overlap with continuous micro-wireportions of the upper electrode are not a part of the lower electrodecross-over area. For embodiments where the upper and lower electrodesare described herein to be complementary, the areal density of activetraces in the upper electrode cross-over area is non-uniform and theareal density of active traces in the lower electrode cross-over area isnon-uniform. To be non-uniform, the areal density of active traces

FIGS. 37 and 38 show one example of a complementary electrode pattern ata cross-over area of an electrode. Lines in the embodiments shown inFIGS. 37 and 38 represent conductor traces. FIG. 37 shows upperelectrode cross-over area 900 a; FIG. 38 shows lower electrodecross-over area 900 b. Both upper and lower electrode cross-over areaswould typically be part of individual electrodes that comprise an upper,or respectively, lower array of electrodes in a touch screen panel. In atouch screen panel, upper electrode cross-over area 900 a would beregistered to and overlaid upon lower electrode cross-over area 900 b inthe manufacturing process.

Upper electrode cross over area 900 a includes an inner electrodepattern 905 a having relatively high active areal conductor (or trace)density; outer electrode pattern 915 a having relatively low activeareal conductor density; and middle electrode pattern 910 a, which has arelative active areal conductor density somewhere in between that of theinner electrode pattern 905 a and the outer electrode pattern 915 a. Incontrast, lower electrode cross over area 900 b includes an innerelectrode pattern 905 b having relatively low active areal conductor (ortrace) density; outer electrode pattern 915 b having relatively highactive areal conductor density; and middle electrode pattern 910 b,which has a relative active areal conductor density somewhere betweenthat of the inner electrode pattern 905 b and the outer electrodepattern 915 b. While referred to as “upper” and “lower” electrode crossover areas, the embodiments shown in FIGS. 37 and 38 (and otherembodiments shown and described subsequently) could be either the upperor the lower cross-over area. The electrode cross-over area 900 a iscomplementary to the electrode cross-over area 900 b because the arealdensity of active traces for electrode cross-over area 900 a variesinversely with the areal density of active traces for electrodecross-over area 900 b.

In the particular embodiments shown in FIGS. 37 and 38, a repeatingpattern of square cells of differing sizes comprises the respectiveinner, middle, and outer patterns, establishing therewith an activeareal conductor density distribution. Active areal conductor (or trace)density is the sum length of active conductor traces per unit of area. Aconductor trace is active if it forms part of the continuous electrodepattern (i.e., discontinuous, isolated conductors would not beconsidered active). Cells may be other than square, and in someembodiments are cell shapes are pseudo-random. Further, as will be shownin later embodiments, active areal conductor density may be establishedwith individual conductors rather than, or in addition to, theconductors that define individual cells in the electrode pattern.

The cell widths show in the embodiments associated with FIGS. 37 and 38are as follows:

-   -   upper electrode cross-over area 900 a (FIG. 37) (6 mm square):        -   inner electrode pattern 905 a: 200 microns        -   middle electrode pattern 910 a: 400 microns        -   outer electrode pattern 915 a: 600 microns    -   lower electrode cross-over area 900 b (FIG. 38) (6 mm square):        -   inner electrode pattern 905 b: 600 microns        -   middle electrode pattern 910 b: 400 microns        -   outer electrode pattern 915 b: 200 microns

The conductor traces depicted in FIGS. 37 and 38 have width of, forexample, 2 microns. The conductor traces have thickness of, for example,0.15 microns. The conductor traces comprise metal, for example silver.

As shown, the cross-over areas represented in the embodiments shown inFIGS. 37 and 38 both have three levels of varying active areal conductordensity. The skilled artisan will recognize myriad other patterns, withmore (or less) than three levels of pattern density—what is shown inFIGS. 37 and 38 is a simple embodiment for illustration only and shouldnot be read as limiting.

FIG. 39 shows a cross-over area when the upper electrode cross-over area900 a is overlaid upon lower electrode cross-over area 900 b, as to forma node in a touch screen panel. In this particular embodiment, the uppercross-over area is off-set from the lower cross-over area, bothhorizontally and vertically by, in this case, about 100 microns. Otheroff-sets are possible. The relationship between active areal conductordensity on position within the cross-over area, for the upper electrodeversus the lower electrode, makes them complementary. Inner electrodepattern of the upper electrode 905 a (with relatively high active arealconductor density) is overlaid upon inner electrode pattern of the lowerelectrode 905 b (with relatively low active areal conductor density),forming inner composite area 922. Inversely, outer electrode pattern ofthe upper electrode 915 a (with relatively low active areal conductordensity) is overlaid upon outer electrode pattern of the lower electrode915 b (with relatively high active areal conductor density), formingouter composite area 926. Middle electrode patterns 910 a and 910 b havethe same active areal conductor densities. The alignment of relativelyhigh active areal conductor density in the upper electrode withrelatively low active areal conductor density in the lower electrode (ininner composite area 922), in combination with alignment of relativelylow active areal conductor density the upper electrode with relativelyhigh active areal conductor density in the upper electrode (in outercomposite area 926) lead the upper and lower electrodes to becomplementary. What is meant by “relatively high” active areal conductordensity at a position within an electrode pattern is that the localactive areal conductor density at that position is higher than theaverage active areal conductor density for that electrode in thecross-over area. What is meant by “relatively low” active arealconductor density at a position within an electrode pattern is that thelocal active areal conductor density at that position is lower than theaverage active areal conductor density for that electrode in the crossover area.

By “complementary,” what is meant is that, for overlaid cross-over areasof a first and second electrode (in a touch screen panel, for example),regions of the cross-over area having lower active areal conductordensity in the first electrode (relative to the average active arealconductor density for the first electrode, in the cross-over area) havehigher active areal conductor density in the second electrode (relativeto the average active areal conductor density for the second electrode,in the cross-over area). In some cases, the complementary feature isalso true for the same cross-over area—i.e., regions of the cross-overarea having higher active areal conductor density in the first electrode(relative to the average active areal conductor density for the firstelectrode, in the cross-over area) have lower active areal conductordensity in the second electrode (relative to the average active arealconductor density for the second electrode, in the cross-over area).

FIG. 40 shows row electrode 930 and column electrode 932, each maderespectively with a series of repeating cross-over areas. Cross-overarea 931 a corresponds to lower cross-over area 900 b of FIG. 38; crossover area 931 b corresponds to upper cross-over area 900 a of FIG. 37.An array of either the row or column electrodes could, for example,comprise the electrode array shown in FIG. 28. Horizontal electrode 930and vertical electrode 932 are shown as having immediately repeatingpatterns of cross-over areas; in other embodiments not shown here thecross-over areas of an individual electrode are separated by a spacerpattern area that is not part of the cross-over area of the assembledtouch screen panel.

FIG. 41 shows touch panel sensor 940, including a lower array of rowelectrodes 930 and an upper array of column electrodes 932. Areas wherethe upper column electrode crosses over the lower row electrode formcross over areas, and at least a portion of the pattern of the crossover areas, as between the upper cross-over area and the lower crossover area, are complementary to one another. Row interconnects 943 a andcolumn interconnects 943 b electrically couple the row and columnelectrodes to touch-sensing electronics (not shown).

FIGS. 42-47 show additional embodiments of upper and lower electrodecross-over areas (in each case, one corresponding to an upper electrodecross-over area and the other corresponding to a lower electrodecross-over area). Each cross-over area is designed to complement anothercross-over area. In each cross-over area of the embodiments shown inthese figures, there are areas of higher active areal conductor densityand areas of lower active areal conductor density. When the upperelectrode cross-over area is registered to and overlaid upon the lowerelectrode cross-over area as part of a manufacturing process, at leastsome areas of one electrode's cross-over area having higher active arealconductor density will correspond to the other electrode's cross-overarea having lower active areal conductor density, and vice versa. Thus,the pairs are complementary.

FIGS. 42 and 43 show complimentary electrode cross-over areas 950 a and950 b, respectively.

FIGS. 44 and 45 show complimentary electrode cross-over areas 952 a and952 b, respectively.

FIGS. 46 and 47 show complimentary electrode cross-over areas 954 a and954 b, respectively. Electrode cross-over area 954 b includes amicro-wire conductors arranged in open pattern 955, which does not formcontiguous cells (earlier embodiments established active areal conductordensity by varying the cell size of square-shaped cells).

Variations on the complementary-type embodiments shown above arepossible. For example, as mentioned the upper and lower cross-over areascould be switched. Conductor widths and/or thicknesses for conductorsthat comprise the active portions of the cross-over areas could also bevaried—for example the width and thickness could decrease in areas whereareal active pattern density increases. Such variation in width couldbe, for example, on the order of 0.1 to 50 microns; 0.25 to 25 microns;0.5 to 10 microns; 0.75 to 4 microns, or 1 to 2 microns. Such variationin thickness could be, for example, on the order of 0.025-20 microns;0.05 to 10 microns; 0.075 to 5 microns; 0.1 to 2.5 microns, or 0.125 to1 microns.

In some embodiments, upper and lower electrodes may also be designedsuch that their patterns, at cross-over areas or nodes (where an upperelectrode crosses over a lower electrode in, for example, a touchpanel), have a different relationship. That is, the areal density ofactive traces (active areal conductor density) of the upper electrode inthe upper electrode cross-over area may be uniform and the areal densityof active traces (active areal conductor density) of the lower electrodecross-over area may be variable (non-uniform), both comprised ofmicro-wire patterns formed of individual conductive traces, wherein atleast a portion of the lower electrode cross-over area has a higheractive areal conductor density than the uniform active areal conductordensity of the upper electrode cross-over area.

In some embodiments, upper and lower electrodes may also be designedsuch that their patterns, at cross-over areas or nodes (where an upperelectrode crosses over a lower electrode in, for example, a touchpanel), have a different relationship. That is, the areal density ofactive traces (active areal conductor density) of the upper electrode inthe upper electrode cross-over area may be variable and the arealdensity of active traces (active areal conductor density) of the lowerelectrode cross-over area may be uniform, both comprised of micro-wirepatterns formed of individual conductive traces, wherein at least aportion of the upper electrode cross-over area has a lower active arealconductor density than the uniform active areal conductor density of thelower electrode cross-over area.

FIG. 48 shows a top plan view of a multilayer touch screen sensorelement 740 where the first and second patterned substrate have beenlaminated. Region 730 represented the overlap of the first and secondcontinuous regions. Region 732 represented the overlap of the firstcontinuous region and the second discontinuous region. Region 734represented the overlap of the second continuous region and the firstdiscontinuous region. And, region 736 represented the overlap betweenthe first and second discontinuous regions. While there was a pluralityof these overlap regions, for ease of illustration, only one region ofeach has been depicted in the figure. Column or row electrodes ofelement 740 may be configured according to embodiments described herein.

One skilled in the art will appreciate that the present invention can bepracticed with embodiments other than those disclosed. The disclosedembodiments are presented for purposes of illustration and notlimitation, and the present invention is limited only by the claims thatfollow.

The invention claimed is:
 1. A multi-layer touch panel, comprising: anupper electrode comprised of an interconnected upper mesh of micro-wireconductors; a lower electrode comprised of an interconnected lower meshof micro-wire conductors; a dielectric disposed between the upperelectrode and lower electrode; wherein the upper electrode crosses-overthe lower electrode at a cross-over area, thus defining an upperelectrode cross-over area having a first conductor pattern, and a lowerelectrode cross-over area having a second conductor pattern; wherein thefirst conductor pattern has a first variable active areal conductordensity and the second conductor pattern has a second variable activeareal conductor density; and, wherein the first and second variableactive areal conductor densities are complementary to one another. 2.The touch panel of claim 1, wherein the first and second patterns arecomprised of micro-wire conductor cells, and wherein the average cellsize of the first pattern is greater than the average cell size of thesecond pattern.
 3. The touch panel of claim 2, wherein the cellscomprise pseudorandom shapes.
 4. The touch panel of claim 2, wherein theaverage cell sizes of the first and second pattern range from between 50micrometers to 1 centimeter.
 5. The touch panel of claim 4, wherein theaverage cell sizes of the first and second pattern range from between100 micrometers and 5 millimeters.
 6. The touch panel of claim 1,wherein the first and second patterns are comprised of micro-wireconductor cells, and wherein the cells of the first pattern have anaverage cell size of between 100 micrometers and 5 millimeters, andwherein the cells of the second pattern have an average cell size ofbetween 50 micrometers and 100 micrometers.
 7. The touch panel of claim1, wherein the upper electrode cross-over area has a first averageactive areal conductor density, the lower electrode cross-over area hasa second average active area conductor density, and the second averageactive area conductor density is greater than the first average activeareal conductor density.
 8. The touch panel of claim 1, wherein theupper mesh and lower mesh comprise metallic traces having widths ofbetween 0.5 and 10 micrometers.
 9. The touch panel of claim 1, whereinthe upper mesh and lower mesh comprise metallic traces having widths ofbetween 0.75 and 5 micrometers.
 10. The touch panel of claim 1, whereinthe upper mesh and the lower mesh comprise curved traces.
 11. Amulti-layer touch panel, comprising: an upper electrode comprised of aninterconnected upper mesh of micro-wire conductors; a lower electrodecomprised of an interconnected lower mesh of micro-wire conductors; adielectric disposed between the upper electrode and lower electrode;wherein the upper electrode crosses-over the lower electrode at across-over area, thus defining an upper electrode cross-over area havinga first conductor pattern, and a lower electrode cross-over area havinga second conductor pattern; wherein the first conductor pattern has auniform active areal conductor density and the second conductor patternhas a variable active areal conductor density; and, wherein at least aportion of the second conductor pattern has a higher active arealconductor density than the active areal conductor density of the firstconductor pattern.
 12. The touch panel of claim 11, wherein the firstand second patterns are comprised of micro-wire conductor cells, andwherein the average cell size of the first pattern is greater than theaverage cell size of the second pattern.
 13. The touch panel of claim12, wherein the cells comprise pseudorandom shapes.
 14. The touch panelof claim 12, wherein the averages cell sizes of the first and secondpattern range from between 50 micrometers to 1 centimeter.
 15. The touchpanel of claim 14, wherein the average cell sizes of the first andsecond pattern range from between 100 micrometers and 5 millimeters. 16.The touch panel of claim 11, wherein the first and second patterns arecomprised of micro-wire conductor cells, and wherein the cells of thefirst pattern have an average cell size of between 100 micrometers and 5millimeters, and wherein the cells of the second pattern have an averagecell size of between 50 micrometers and 100 micrometers.
 17. The touchpanel of claim 11, wherein the upper electrode cross-over area has afirst average active areal conductor density, the lower electrodecross-over area has a second average active area conductor density, andthe second average active area conductor density is greater than thefirst average active areal conductor density.
 18. The touch panel ofclaim 11, wherein the upper mesh and lower mesh comprise metallic traceshaving widths of between 0.5 and 10 micrometers.
 19. The touch panel ofclaim 11, wherein the upper mesh and lower mesh comprise metallic traceshaving widths of between 0.75 and 5 micrometers.
 20. The touch panel ofclaim 11, wherein the upper mesh and the lower mesh comprise curvedtraces.
 21. A multi-layer touch panel, comprising: an upper electrodecomprised of an interconnected upper mesh of micro-wire conductors; alower electrode comprised of an interconnected lower mesh of micro-wireconductors; a dielectric disposed between the upper electrode and lowerelectrode; wherein the upper electrode crosses-over the lower electrodeat a cross-over area, thus defining an upper electrode cross-over areahaving a first conductor pattern, and a lower electrode cross-over areahaving a second conductor pattern; wherein the first conductor patternhas a variable active areal conductor density and the second conductorpattern has a uniform active areal conductor density; and, wherein atleast a portion of the first conductor pattern has a lower active arealconductor density than the active areal conductor density of the secondconductor pattern.
 22. The touch panel of claim 11, wherein the firstand second patterns are comprised of micro-wire conductor cells, andwherein the average cell size of the first pattern is greater than theaverage cell size of the second pattern.
 23. The touch panel of claim22, wherein the cells comprise pseudorandom shapes.
 24. The touch panelof claim 22, wherein the cell sizes of the first and second patternrange from between 50 micrometers to 1 centimeter.
 25. The touch panelof claim 24, wherein the cell sizes of the first and second patternrange from between 100 micrometers and 5 millimeters.
 26. The touchpanel of claim 21, wherein the first and second patterns are comprisedof micro-wire conductor cells, and wherein the cells of the firstpattern have an average cell size of between 100 micrometers and 5millimeters, and wherein the cells of the second pattern have an averagecell size of between 50 micrometers and 100 micrometers.
 27. The touchpanel of claim 21, wherein the upper electrode cross-over area has afirst average active areal conductor density, the lower electrodecross-over area has a second average active area conductor density, andthe second average active area conductor density is greater than thefirst average active areal conductor density.
 28. The touch panel ofclaim 21, wherein the upper mesh and lower mesh comprise metallic traceshaving widths of between 0.5 and 10 micrometers.
 29. The touch panel ofclaim 21, wherein the upper mesh and lower mesh comprise metallic traceshaving widths of between 0.75 and 5 micrometers.
 30. The touch panel ofclaim 21, wherein the upper mesh and the lower mesh comprise curvedtraces.